Tapered Through-Silicon-Via Interconnects for Wafer-Level Packaging of Sensor Devices
Leib, Jüergen, Bieck, Florian, Hansen, Ulli, Kok-Kheong Looi, Ha-Duong Ngo, Seidemann, Volker, Shariff, Dzafir, Studzinski, Daniel, Suthiwongsunthorn, Nathapong, Tan, Kenneth, Wilke, Ralph, Kwong-Loon Yam, Töpper, Michael
Published in IEEE transactions on advanced packaging (01.08.2010)
Published in IEEE transactions on advanced packaging (01.08.2010)
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