Assessment of Delamination Risk During the Package Sawing Process by Simulation
bin Yahaya, Khairul Ikhsan, Kong, Chen Wei, Leung, Max
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Paddle tilt towards Paddle Flash performance on small outline package
Ting, Kow Siew, Jia Yunn, Ting, Yahaya, Khairul Ikhsan, Choo Tian, Ooi
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Get full text
Conference Proceeding