Bond Wire Damage Detection Method on Discrete MOSFETs Based on Two-Port Network Measurement
Yun, Minghui, Cai, Miao, Yang, Daoguo, Yang, Yiren, Xiao, Jing, Zhang, Guoqi
Published in Micromachines (Basel) (07.07.2022)
Published in Micromachines (Basel) (07.07.2022)
Get full text
Journal Article
Failure quantitative assessment approach to MOSFET power device by detecting parasitic parameters
Yun, Minghui, Yang, Daoguo, He, Siliang, Cai, Miao, Xiao, Jing, Zhang, Kailin, Zhang, Guo-Qi
Published in Frontiers in physics (17.10.2022)
Published in Frontiers in physics (17.10.2022)
Get full text
Journal Article
Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs
Cai, Miao, Liang, Yonghu, Yun, Minghui, Chen, Xuan-You, Yan, Haidong, Yu, Zhaozhe, Yang, Daoguo, Zhang, Guoqi
Published in IEEE access (2019)
Published in IEEE access (2019)
Get full text
Journal Article
Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization
He, Hengjian, Cai, Miao, Yun, Minghui, Chen, Hao, Wang, Huanhuan, Yang, Daoguo
Published in IEEE transactions on instrumentation and measurement (01.01.2024)
Published in IEEE transactions on instrumentation and measurement (01.01.2024)
Get full text
Journal Article
Microwave dielectric characterisation of SiO2 thin films through a single MIM test structure
Zhen Qin, Wenbin Chen, Xiaolei Wang, Daoguo Yang, Miao Cai, Minghui Yun
Published in 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.06.2016)
Published in 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.06.2016)
Get full text
Conference Proceeding
The insertion loss of coplanar waveguide structure on PMNT thin films
Xiaolei Wang, Wenbin Chen, Zhen Qin, Daoguo Yang, Miao Cai, Minghui Yun
Published in 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.06.2016)
Published in 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.06.2016)
Get full text
Conference Proceeding
De-embedding transmission line of SiO2 thin-film measurements for accurate characteristics
Wenbin Chen, Minghui Yun, Miao Cai, Xiaolei Wang, Zhen Qin, Daoguo Yang
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Get full text
Conference Proceeding
Thermal characteristics analysis and optimization of 3D-Stacked Memory Packaging
Cao, Fengzhe, Yang, Wen, Yun, Minghui, Yang, Daoguo
Published in 2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) (07.02.2023)
Published in 2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) (07.02.2023)
Get full text
Conference Proceeding
Comparison experiment of Parasitic Inductance Extraction of power module based on ANSYS Q3D software
Zhang, Kailin, Cai, Miao, Yun, Minghui, Song, Lei, Yang, Daoguo
Published in 2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS) (06.12.2021)
Published in 2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS) (06.12.2021)
Get full text
Conference Proceeding
Study on Defect Detection and Impact on Heat Dissipation in Nanosilver Substrates
Liu, Mengyuan, Cai, Miao, Luo, Yinyin, Wei, Jinxiu, Yun, Minghui, Yang, Daoguo
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Get full text
Conference Proceeding
Structural design and optimization of rectifier module based on copper-clip bonding technology
Wei, Jinxiu, Gao, Yongjie, Cai, Miao, Yun, Minghui, Liu, Mengyuan, Yang, D.G.
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Get full text
Conference Proceeding
Package design and PI simulation of AC-DC circuit
Zhang, Yuhang, Yun, Minghui, Cao, Fengzhe, Su, Xiaoxu, Zheng, Dan, Yang, Daoguo
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Get full text
Conference Proceeding
Crustal velocity structure in the Emeishan large igneous province and evidence of the Permian mantle plume activity
Xu, Tao, Zhang, ZhongJie, Liu, BaoFeng, Chen, Yun, Zhang, MingHui, Tian, XiaoBo, Xu, YiGang, Teng, JiWen
Published in Science China. Earth sciences (01.07.2015)
Published in Science China. Earth sciences (01.07.2015)
Get full text
Journal Article
Extraction, Optimization and Failure Detection Application of Parasitic Inductance for High-Frequency SiC Power Devices
Yun, Minghui, Zhang, Kailin, Cai, Miao, Yang, Yiren, Feng, Changqi, Wei, Song, Yang, Daoguo, Zhang, Guoqi
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Get full text
Conference Proceeding
The Effects of Redundant Control Inputs in Finite-Time Optimal Control
Xia, Yaping, Cai, Chenxiao, Yin, Minghui, Zou, Yun
Published in Journal of systems science and complexity (01.12.2016)
Published in Journal of systems science and complexity (01.12.2016)
Get full text
Journal Article
Two new upper bounds of the solution for the continuous algebraic Riccati equation and their application
Xia, YaPing, Cai, ChenXiao, Yin, MingHui, Zou, Yun
Published in Science China. Information sciences (01.05.2015)
Published in Science China. Information sciences (01.05.2015)
Get full text
Journal Article
POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE
CAI MIAO, YUN MINGHUI, WANG ZHAOXING, LI GUIHAI, WEI JINXIU, LIU MENGYUAN, LUO YINYIN
Year of Publication 01.08.2023
Get full text
Year of Publication 01.08.2023
Patent
Detection assembly and detection method
CAI MIAO, YUN MINGHUI, XIAO JING, WEI JINXIU, LIU MENGYUAN, ZHANG YUTING, LUO YINYIN
Year of Publication 14.07.2023
Get full text
Year of Publication 14.07.2023
Patent
Detection assembly and detection instrument
YUN MINGHUI, CAI MIAO, YANG DAOGUO, XIAO JING, GAO YONGJIE, LIU DONGJING, WEI SONG
Year of Publication 23.06.2023
Get full text
Year of Publication 23.06.2023
Patent