Search Results - "YUKAWA KEN" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

$Refractory Infection of Mycobacterium abscessus: Skin and Soft Tissue Infection Recurred under Combination Therapy of Surgery and Outpatient Antibiotics$

Refractory Infection of Mycobacterium abscessus: Skin and Soft Tissue Infection Recurred under Combination Therapy of Surgery and Outpatient Antibiotics

by Yamada, Atsuki, Yukawa, Ken, Eguchi, Tomoaki
Published in Journal of Plastic and Reconstructive Surgery (2024)

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Journal Article

Long-term morphological evaluation of porous poly-DL-lactic acid for soft tissue augmentation

Long-term morphological evaluation of porous poly-DL-lactic acid for soft tissue augmentation

by Ken, Yukawa, Noriko, Tachikawa, Motohiro, Munakata, Norio, Akino, Shohei, Kasugai
Published in Open journal of regenerative medicine (Irvine, CA) (2013)

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Journal Article

A clinical investigation of new patients who had already received treatment with dental implants at other clinics in seventeen years

A clinical investigation of new patients who had already received treatment with dental implants at other clinics in seventeen years

by Yukawa, Ken, Tachikawa, Noriko, Munakata, Motohiro, Shiota, Makoto, Kasugai, Shohei
Published in Kōkūbyō Gakkai Zasshi (01.03.2014)

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Journal Article

Differences in knowledge related to dental implants between patients with and without a treatment history of dental implants

Differences in knowledge related to dental implants between patients with and without a treatment history of dental implants

by Ken, Yukawa, Tachikawa, Noriko, Kasugai, Shohei
Published in Clinical oral implants research (01.09.2017)

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Journal Article

HEAT DISSIPATION MATERIAL ADHERING COMPOSITION HEAT DISSIPATION MATERIAL HAVING ADHESIVE INLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME

HEAT DISSIPATION MATERIAL ADHERING COMPOSITION HEAT DISSIPATION MATERIAL HAVING ADHESIVE INLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME

by UMEDA HIROAKI, YUKAWA KEN, MATSUDA KAZUHIRO
Year of Publication 25.07.2022

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Patent

Appendix penetrating into the sigmoid colon: report of a case

Appendix penetrating into the sigmoid colon: report of a case

by Kurokawa, Yukinori, Nishisho, Isamu, Mishima, Hideyuki, Yukawa, Ken-ichi, Kikkawa, Nobuteru
Published in The American journal of gastroenterology (2000)

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Journal Article

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

by ANDO NORIHISA, TAMAKI KENYA, KANEKO HIDEKI, SATO TAKAAKI, YUKAWA KEN, MASUDA YOSHITAKE, ITO SHINYA, YOSHII AKITOSHI
Year of Publication 26.12.2023

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Patent

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

by ANDO NORIHISA, TAMAKI KENYA, KANEKO HIDEKI, YUKAWA KEN, MASUDA YOSHITAKE, ITO SHINYA, YOSHII AKITOSHI
Year of Publication 05.09.2023

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Patent

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

by ANDO NORIHISA, TAMAKI KENYA, KANEKO HIDEKI, SATO TAKAAKI, YUKAWA KEN, MASUDA YOSHITAKE, ITO SHINYA, YOSHII AKITOSHI
Year of Publication 05.09.2023

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Patent

Morphological Evaluation of Soft Tissue Augmentation Using Porous Poly-DL-Lactic Acid With Straight Holes

Morphological Evaluation of Soft Tissue Augmentation Using Porous Poly-DL-Lactic Acid With Straight Holes

by Ken, Yukawa, Noriko, Tachikawa, Furuichi, Akiko, Shohei, Kasugai
Published in Implant dentistry (01.12.2016)

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Journal Article

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

by ANDO NORIHISA, TAMAKI KENYA, KANEKO HIDEKI, YUKAWA KEN, MASUDA YOSHITAKE, ITO SHINYA, YOSHII AKITOSHI
Year of Publication 09.03.2023

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Patent

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

by ANDO NORIHISA, TAMAKI KENYA, KANEKO HIDEKI, YUKAWA KEN, MASUDA YOSHITAKE, ITO SHINYA, YOSHII AKITOSHI
Year of Publication 09.03.2023

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Patent

방열 기판, 방열 회로 구성체, 및 그 제조 방법

방열 기판, 방열 회로 구성체, 및 그 제조 방법

by UMEDA HIROAKI, YUKAWA KEN, MATSUDA KAZUHIRO
Year of Publication 20.08.2019

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Patent

도전성 도료 및 이것을 사용한 차폐 패키지의 제조 방법

도전성 도료 및 이것을 사용한 차폐 패키지의 제조 방법

by UMEDA HIROAKI, YUKAWA KEN, MATSUDA KAZUHIRO
Year of Publication 26.11.2018

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Patent

도전성 도료 및 그것을 사용한 차폐 패키지의 제조 방법

도전성 도료 및 그것을 사용한 차폐 패키지의 제조 방법

by UMEDA HIROAKI, YUKAWA KEN, MATSUDA KAZUHIRO
Year of Publication 26.11.2018

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Patent

도전성 도료 및 이것을 사용한 차폐 패키지의 제조 방법

도전성 도료 및 이것을 사용한 차폐 패키지의 제조 방법

by UMEDA HIROAKI, YUKAWA KEN, MATSUDA KAZUHIRO
Year of Publication 26.11.2018

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Patent

HEAT DISSIPATION BOARD, HEAT DISSIPATION CIRCUIT STRUCTURE, AND METHOD FOR MANUFACTURING SAME

HEAT DISSIPATION BOARD, HEAT DISSIPATION CIRCUIT STRUCTURE, AND METHOD FOR MANUFACTURING SAME

by MATSUDA, Kazuhiro, YUKAWA, Ken, UMEDA, Hiroaki
Year of Publication 05.07.2018

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Patent

방열재료 접착용 조성물, 접착제 부착 방열재료, 인레이 기판 및 그 제조방법

방열재료 접착용 조성물, 접착제 부착 방열재료, 인레이 기판 및 그 제조방법

by UMEDA HIROAKI, YUKAWA KEN, MATSUDA KAZUHIRO
Year of Publication 06.03.2018

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Patent

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACKAGE USING CONDUCTIVE COATING MATERIAL

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACKAGE USING CONDUCTIVE COATING MATERIAL

by MATSUDA, Kazuhiro, YUKAWA, Ken, UMEDA, Hiroaki
Year of Publication 05.10.2017

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Patent

CONDUCTIVE COATING AND MANUFACTURING METHOD OF SHIELD PACKAGE USING THE SAME

CONDUCTIVE COATING AND MANUFACTURING METHOD OF SHIELD PACKAGE USING THE SAME

by UMEDA HIROAKI, YUKAWA KEN, MATSUDA KAZUHIRO
Year of Publication 05.10.2017

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Patent