Integrated flow-thermomechanical and reliability analysis of a low air cooled flip chip-PBGA package
Hong, Bor Zen, Yuan, Tsorng-Dih
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Conference Proceeding
Journal Article
Low-K Flip Chip Board Level Reliability on 65nm Technology
Pei-Haw Tsao, Bill Kiang, Wu, K., Abel Chang, Tsomg-Dih Yuan
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Performance projection and thermal management of high performance VLSI designs
Wang, L.K., Chen, H.H., Tsorng-Dih Yuan, Bor Zen Hong
Published in 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) (2001)
Published in 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) (2001)
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Conference Proceeding
Thermal management for high performance integrated circuits with non-uniform chip power considerations
Tsorng-Dih Yuan, Bor Zen Hong, Chen, H.H., Li-Kong Wang
Published in Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) (2001)
Published in Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) (2001)
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Conference Proceeding