Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
Yang Liu, Jia Zhao, Yuan, Cadmus Chang-Ann, Zhang, Guoqi Q., Fenglian Sun
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2014)
Get full text
Journal Article
Sensitivity Design of the Chip-in-Substrate Package Using DOE with Factorial Analysis Technology
Ming-Chih Yew, Chang-Ann Yuan, Kuo-Ning Chiang, Yu-Hua Chen, Wen-Kung Yang
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
Get full text
Conference Proceeding
Design and analysis of novel glass WLCSP structure
Chang-Ann Yuan, Cheng Nan Han, Kou-Ning Chiang
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
Get full text
Conference Proceeding
Automatic Defect Segmentation on Leather with Deep Learning
Liong, Sze-Teng, Gan, Y. S, Huang, Yen-Chang, Yuan, Chang-Ann, Chang, Hsiu-Chi
Year of Publication 28.03.2019
Year of Publication 28.03.2019
Get full text
Journal Article
Automatic Defect Segmentation on Leather with Deep Learning
Sze-Teng Liong, Gan, Y S, Yen-Chang, Huang, Chang-Ann, Yuan, Chang, Hsiu-Chi
Published in arXiv.org (28.03.2019)
Get full text
Published in arXiv.org (28.03.2019)
Paper
Multi-diameter clamp for clamping on tires of different sizes
Ma, Ruey-Liang, Sun, Yuan-Heng, Lin, Meng-Ru, Yu, Jen-Yu, Lee, Kang-Feng, Chang, Yuan-Ann
Year of Publication 07.08.2018
Get full text
Year of Publication 07.08.2018
Patent
MULTI-DIAMETER CLAMP FOR CLAMPING ON TIRES OF DIFFERENT SIZES
LEE KANG-FENG, CHANG YUAN-ANN, LIN MENG-RU, SUN YUAN-HENG, MA RUEY-LIANG, YU JEN-YU
Year of Publication 23.06.2016
Get full text
Year of Publication 23.06.2016
Patent
Design, analysis, and development of novel three-dimensional stacking WLCSP
Yuan, C.-A., Cheng Nan Han, Ming-Chih Yew, Chan-Yen Chou, Kou-Ning Chiang
Published in IEEE transactions on advanced packaging (01.08.2005)
Published in IEEE transactions on advanced packaging (01.08.2005)
Get full text
Journal Article