Search Results - "YU CHEN HUA" :: K.UTB vyhledávací portál

by Chen, Yu-Hua, Choi, Woosung, Liao, Wei-Hsiang, Martínez-Ramírez, Marco, Cheuk, Kin Wai, Mitsufuji, Yuki, Jang, Jyh-Shing Roger, Yang, Yi-Hsuan
Year of Publication 22.06.2024

Get full text

Journal Article

Loading…

Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package

by Yu, Chen-Hua, Yee, Kuo-Chung
Year of Publication 25.04.2023

Get full text

Patent

Loading…

Wafer level chip scale packaging intermediate structure apparatus and method

by Yu, Chen-Hua, Yeh, Der-Chyang
Year of Publication 18.04.2023

Get full text

Patent

Loading…

Sensitivity Design of the Chip-in-Substrate Package Using DOE with Factorial Analysis Technology

by Ming-Chih Yew, Chang-Ann Yuan, Kuo-Ning Chiang, Yu-Hua Chen, Wen-Kung Yang
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)

Get full text

Conference Proceeding

Loading…

Semiconductor device and method of manufacture

by Yu, Chen-Hua, Wu, Jiun Yi
Year of Publication 28.03.2023

Get full text

Patent

Loading…

Semiconductor Die Contact Structure and Method

by Yu, Chen-Hua, Liu, Chung-Shi
Year of Publication 23.03.2023

Get full text

Patent

Loading…

Packages with Si-substrate-free interposer and method forming same

by Yu, Chen-Hua, Chen, Ming-Fa
Year of Publication 21.03.2023

Get full text

Patent

Loading…

Semiconductor device and manufacturing method thereof

by Yu, Chen-Hua, Chiou, Wen-Chih
Year of Publication 21.03.2023

Get full text

Patent

Loading…

Cloning, distribution and functional analysis of the type III sodium channel from human brain

by Chen, Yu Hua, Dale, Timothy J., Romanos, Michael A., Whitaker, William R. J., Xie, Xin Min, Clare, Jeffrey J.
Published in The European journal of neuroscience (01.12.2000)

Get full text

Journal Article