Method of fabricating a memory card using SiP/SMT hybrid technology
Ye, Ning, Miller, Robert C, Yu, Cheemen, Takiar, Hem, McKenzie, Andre
Year of Publication 27.11.2012
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Year of Publication 27.11.2012
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Semiconductor die having a redistribution layer
Liao, Chien-Ko, Chiu, Chin-Tien, Chien, Jack Chang, Yu, Cheemen, Takiar, Hem
Year of Publication 03.07.2012
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Year of Publication 03.07.2012
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Semiconductor package having through holes for molding back side of package
Chiu, Chin-Tien, Takiar, Hem, Liao, Chih-Chin, Yu, Cheemen, Ye, Ning, Chien, Jack Chang
Year of Publication 31.05.2011
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Year of Publication 31.05.2011
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Method of fabricating a semiconductor package having through holes for molding back side of package
Chiu, Chin-Tien, Takiar, Hem, Liao, Chih-Chin, Yu, Cheemen, Ye, Ning, Chien, Jack Chang
Year of Publication 10.05.2011
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Year of Publication 10.05.2011
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Memory card fabricated using SiP/SMT hybrid technology
Ye, Ning, Miller, Robert C, Yu, Cheemen, Takiar, Hem, McKenzie, Andre
Year of Publication 10.08.2010
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Year of Publication 10.08.2010
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Method of fabricating a semiconductor die having a redistribution layer
Liao, Chien-Ko, Chiu, Chin-Tien, Chien, Jack Chang, Yu, Cheemen, Takiar, Hem
Year of Publication 10.08.2010
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Year of Publication 10.08.2010
Patent
Semiconductor die having a distribution layer
Liao, Chien-Ko, Chiu, Chin-Tien, Chien, Jack Chang, Yu, Cheemen, Takiar, Hem
Year of Publication 27.07.2010
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Year of Publication 27.07.2010
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Method of minimizing kerf width on a semiconductor substrate panel
Liao, Chih-Chin, Ye, Ning, Yu, Cheemen, Chien, Jack Chang, Takiar, Hem
Year of Publication 03.11.2009
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Year of Publication 03.11.2009
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Substrate warpage control and continuous electrical enhancement
Yu, Cheemen, Wang, Ken Jian Ming, Chiu, Chin-Tien, Liao, Chih-Chin, Chen, Han-Shiao
Year of Publication 26.05.2009
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Year of Publication 26.05.2009
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Rounded contact fingers on substrate/PCB for crack prevention
Takiar, Hem, Yu, Cheemen, Wang, Ken Jian Ming, Chiu, Chin-Tien, Chen, Han-Shiao, Liao, Chih-Chin
Year of Publication 05.10.2010
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Year of Publication 05.10.2010
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