Search Results - "YU CHEEMEN" :: K.UTB vyhledávací portál

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Die package with asymmetric leadframe connection

by YU, CHEEMEN, TAKIAR, HEM, LEE, MING HSUN, LIAO, CHIH CHIN
Year of Publication 21.03.2010

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Printed circuit board

by YU, CHEEMEN, TAKIAR, HEM, CHEN, HAN SHIAO, LIAO, CHIH CHIN, WANG, KEN JIAN MING, CHIU, CHIN TIEN
Year of Publication 11.06.2011

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Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards

by YU, CHEEMEN, TAKIAR, HEM, LIU, NING, CHIU, CHIN TIEN, CHANG, CHE JUNG, CHIEN, JACK CHANG
Year of Publication 01.05.2011

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Padless substrate for surface mounted components

by YU, CHEEMEN, TAKIAR, HEM, CHEN, HAN SHIAO, LIAO, CHIH CHIN, WANG, KEN JIAN MING, BHAGATH, SHRIKAR, CHIU, CHIN TIEN, CHIEN, JACK CHANG
Year of Publication 11.02.2012

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Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel and substrate panel

by YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, CHIEN, JACKANG, YE, NING
Year of Publication 01.05.2009

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Semiconductor die having a redistribution layer and the method for fabricating the same

by YU, CHEEMEN, TAKIAR, HEM, CHIEN, JACKANG, CHIU, CHIN-TIEN, LIAO, CHIEN-KO
Year of Publication 01.03.2009

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Semiconductor die having a redistribution layer

by CHIU CHIN-TIEN, TAKIAR HEM, YU CHEEMEN, CHIEN JACK CHANG, LIAO CHIEN-KO
Year of Publication 30.06.2010

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Padless substrate for surface mounted components

by TAKIAR HEM, YU CHEEMEN, CHIEN JACK CHANG, WANG KEN JIAN MING, BHAGATH SHRIKAR
Year of Publication 17.12.2008

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Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

by YU, CHEEMEN, TAKIAR, HEM, CHEN, HAN SHIAO, LIAO, CHIH CHIN, WANG, KEN JIAN MING, CHIU, CHIN TIEN
Year of Publication 11.01.2010

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Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

by CHIU CHIN TIEN, TAKIAR HEM, YU CHEEMEN, LIAO CHIH CHIN, WANG KEN JIAN MING, CHEN HAN SHIAO
Year of Publication 07.10.2009

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Molded SIP package with reinforced solder columns and method of reducing mechanical stress on a semiconductor die during fabrication

by TAKIAR, HEM, ZHU, JAVA, YU, CHEEMEN, LIU, HUI, CHANGIEN, JACK, CHIU, CHIN-TIEN
Year of Publication 01.03.2008

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Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

by YU, CHEEMEN, TAKIAR, HEM, LIU, NING, CHIEN, JACKANG, CHANG, CHE-JUNG, CHIU, CHIN-TIEN
Year of Publication 16.01.2008

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Semiconductor device with a distributed plating pattern and method of reducing stress thereon

by YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, CHEN, HAN-SHIAO, CHIU, CHIN-TIEN
Year of Publication 16.01.2008

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Padless substrate for surface mounted components

by CHIU CHIN-TIEN, TAKIAR HEM, CHEN HAN-SHIAO, YU CHEEMEN, LIAO CHIHIN, CHIEN JACK CHANG, WANG KEN JIAN MING, BHAGATH SHRIKAR
Year of Publication 14.04.2010

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Die package with asymmetric leadframe connection

by YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, LEE, MING-HSUN
Year of Publication 16.02.2007

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Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

by CHIU CHIN TIEN, TAKIAR HEM, YU CHEEMEN, LIAO CHIH CHIN, WANG KEN JIAN MING, CHEN HAN SHIAO
Year of Publication 06.08.2008

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Printed circuit board with coextensive electrical connectors and contact pad areas

by YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, WANG, KEN JIAN MING, CHEN, HAN-SHIAO, CHIU, CHIN-TIEN
Year of Publication 16.02.2008

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Interconnected IC packages with vertical SMT pads

by TSAI, MENG-JU, YU, CHEEMEN, TAKIAR, HEM, CHIU, CHIN-TIEN, CHIEN, JACK CHANG
Year of Publication 16.09.2007

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Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

by YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, CHEN, HAN-SHIAO, WANG, KEN JIAN-MING, CHIU, CHIN-TIEN
Year of Publication 16.12.2006

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Padless substrate for surface mounted components

by YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, CHIEN, JACKANG, BHAGATH, SHRIKAR, CHEN, HAN-SHIAO, WANG, KEN JIAN-MING, CHIU, CHIN-TIEN
Year of Publication 01.10.2007

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