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Year of Publication 11.06.2011
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Year of Publication 11.02.2012
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Semiconductor die having a redistribution layer and the method for fabricating the same
YU, CHEEMEN, TAKIAR, HEM, CHIEN, JACKANG, CHIU, CHIN-TIEN, LIAO, CHIEN-KO
Year of Publication 01.03.2009
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Year of Publication 01.03.2009
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Semiconductor die having a redistribution layer
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Year of Publication 30.06.2010
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Padless substrate for surface mounted components
TAKIAR HEM, YU CHEEMEN, CHIEN JACK CHANG, WANG KEN JIAN MING, BHAGATH SHRIKAR
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Year of Publication 17.12.2008
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Semiconductor device with a distributed plating pattern and method of reducing stress thereon
YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, CHEN, HAN-SHIAO, CHIU, CHIN-TIEN
Year of Publication 16.01.2008
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Year of Publication 16.01.2008
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Padless substrate for surface mounted components
CHIU CHIN-TIEN, TAKIAR HEM, CHEN HAN-SHIAO, YU CHEEMEN, LIAO CHIHIN, CHIEN JACK CHANG, WANG KEN JIAN MING, BHAGATH SHRIKAR
Year of Publication 14.04.2010
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Year of Publication 14.04.2010
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Printed circuit board with coextensive electrical connectors and contact pad areas
YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, WANG, KEN JIAN MING, CHEN, HAN-SHIAO, CHIU, CHIN-TIEN
Year of Publication 16.02.2008
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Year of Publication 16.02.2008
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Interconnected IC packages with vertical SMT pads
TSAI, MENG-JU, YU, CHEEMEN, TAKIAR, HEM, CHIU, CHIN-TIEN, CHIEN, JACK CHANG
Year of Publication 16.09.2007
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Year of Publication 16.09.2007
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Padless substrate for surface mounted components
YU, CHEEMEN, TAKIAR, HEM, LIAO, CHIHIN, CHIEN, JACKANG, BHAGATH, SHRIKAR, CHEN, HAN-SHIAO, WANG, KEN JIAN-MING, CHIU, CHIN-TIEN
Year of Publication 01.10.2007
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Year of Publication 01.10.2007
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