Search Results - "YU, TU-HAO" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Fabrication of Large-Scale High-Mobility Flexible Transparent Zinc Oxide Single Crystal Wafers

Fabrication of Large-Scale High-Mobility Flexible Transparent Zinc Oxide Single Crystal Wafers

by Chen, Yi-Cheng, Tu, Yu-Hao, Chen, Li-Wei, Lai, Yu-Hong, Tsai, Meng-Fu, Lin, Ying-Xiu, Lai, Hou-Chou, Chiang, Ching-Yu, Liu, Heng-Jui, Pan, Hsin-Che, Yang, Tzu-Yi, Zhang, Dawei, Seidel, Jan, Wu, Jyh-Ming, Chueh, Yu-Lun, Chang, Wen-Hao, Ku, Ching-Shun, Chen, Shih-Hsun, Chang, Li, Chu, Ying-Hao
Published in ACS applied materials & interfaces (28.04.2021)

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Journal Article

Superconductive MgB2 Intercalated Muscovite with Dynamically Tunable Stress

Superconductive MgB2 Intercalated Muscovite with Dynamically Tunable Stress

by Kuo, Shu-Hua, Chen, Yi-Cheng, Wang, Yu-Chieh, Hsieh, Wan-Zhen, Chiang, Ching-Yu, Cheng, Cheng-Maw, Chen, Lu-Hsing, Chen, Kuo-Ping, Tu, Yu-Hao, Lin, Jiunn-Yuan, Chu, Ying-Hao
Published in ACS omega (24.09.2024)

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Journal Article

Optical polarization states of a liquid-crystal blue phase II

Optical polarization states of a liquid-crystal blue phase II

by Chen, Hui-Yu, Tu, Hao-Yu
Published in OSA continuum (15.02.2019)

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Journal Article

Superconductive MgB 2 Intercalated Muscovite with Dynamically Tunable Stress

Superconductive MgB 2 Intercalated Muscovite with Dynamically Tunable Stress

by Kuo, Shu-Hua, Chen, Yi-Cheng, Wang, Yu-Chieh, Hsieh, Wan-Zhen, Chiang, Ching-Yu, Cheng, Cheng-Maw, Chen, Lu-Hsing, Chen, Kuo-Ping, Tu, Yu-Hao, Lin, Jiunn-Yuan, Chu, Ying-Hao
Published in ACS omega (24.09.2024)

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Journal Article

SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTIVE WAFER AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTIVE WAFER AND METHODS OF MAKING THE SAME

by Ting, Kuo-Chiang, Lin, Chia-Ching, Laio, Shun-Jang, Yu, Tu-Hao, Wang, Chien-Chung
Year of Publication 28.09.2023

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Patent

Method for manufacturing semiconductor package structure

Method for manufacturing semiconductor package structure

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Chen, Weiming Chris
Year of Publication 13.08.2024

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Patent

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNECT DIE

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNECT DIE

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Wu, Chi-Hsi
Year of Publication 01.08.2024

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Patent

Encapsulated package including device dies connected via interconnect die

Encapsulated package including device dies connected via interconnect die

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Wu, Chi-Hsi
Year of Publication 07.05.2024

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Patent

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yu, Tu-Hao, Wu, Chi-Hsi, Lin, Pin-Tso, Chen, Chia-Hsin
Year of Publication 03.09.2024

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Patent

Semiconductor device

Semiconductor device

by Ting, Kuo-Chiang, Hou, Shang-Yun, Yu, Tu-Hao, Wu, Chi-Hsi, Chen, Weiming Chris
Year of Publication 22.11.2022

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Patent

Interconnect Chips

Interconnect Chips

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Wu, Chi-Hsi
Year of Publication 20.04.2023

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Patent

Package containing device dies and interconnect die and redistribution lines

Package containing device dies and interconnect die and redistribution lines

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Wu, Chi-Hsi
Year of Publication 20.12.2022

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Patent

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yu, Tu-Hao, Wu, Chi-Hsi, Lin, Pin-Tso, Chen, Chia-Hsin
Year of Publication 18.10.2022

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Patent

Interconnect Chips

Interconnect Chips

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Wu, Chi-Hsi
Year of Publication 01.04.2021

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Patent

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

by Ting, Kuo-Chiang, Hou, Shang-Yun, Yu, Tu-Hao, Wu, Chi-Hsi, Chen, Weiming Chris
Year of Publication 16.04.2020

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Patent

Interconnect chips

Interconnect chips

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Wu, Chi-Hsi
Year of Publication 15.12.2020

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Patent

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

by Ting, Kuo-Chiang, Hou, Shang-Yun, Yu, Tu-Hao, Wu, Chi-Hsi, Chen, Weiming Chris
Year of Publication 17.12.2019

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Patent

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

by Ting, Kuo-Chiang, Lee, Wan-Yu, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Chen, Weiming Chris, Su, Yu-Jie
Year of Publication 05.10.2021

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Patent

Interconnect chips

Interconnect chips

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Wu, Chi-Hsi
Year of Publication 21.07.2020

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Patent

Interconnect Chips

Interconnect Chips

by Ting, Kuo-Chiang, Hou, Shang-Yun, Hsu, Chia-Hao, Yeh, Ting-Yu, Yu, Tu-Hao, Wu, Chi-Hsi
Year of Publication 23.01.2020

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Patent