Predicting synergy in atomic layer etching
Kanarik, Keren J., Tan, Samantha, Yang, Wenbing, Kim, Taeseung, Lill, Thorsten, Kabansky, Alexander, Hudson, Eric A., Ohba, Tomihito, Nojiri, Kazuo, Yu, Jengyi, Wise, Rich, Berry, Ivan L., Pan, Yang, Marks, Jeffrey, Gottscho, Richard A.
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01.09.2017)
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01.09.2017)
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Journal Article
Dry Deposition and Dry Development of Metal Oxide Based Photoresist
Kenane, Nizan, Silva, Anuja De, Haider, Ali, Hoang, Linh, Huang, Ching-Chung, Kam, Benjamin, Kim, Ji Yeon, Lee, Younghee, Li, Da, Tan, Samantha, Weidman, Tim, Wu, Cheng Hao, Yu, Jengyi, Zhang, Guoyan, Zhang, Yichi, Brainard, Robert L., Denbeaux, Gregory, Maldonado, Nicolas, Upadhyay, Nitinkumar S., Sherwood, Mark
Published in Journal of Photopolymer Science and Technology (25.06.2024)
Published in Journal of Photopolymer Science and Technology (25.06.2024)
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Journal Article
Advanced integrated metallization enables 3D-IC TSV scaling
Jengyi Yu, Gopinath, Sanjay, Nalla, Praveen, Thorum, Matthew, Schloss, Larry, Anjos, Daniela M., Meshram, Prashant, Harm, Greg, Richardson, Joe, Mountsier, Tom
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
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Conference Proceeding
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module
Van Huylenbroeck, Stefaan, Yunlong Li, Stucchi, Michele, Bogaerts, Lieve, De Vos, Joeri, Beyer, Gerald, Beyne, Eric, Brouri, Mohand, Nalla, Praveen, Gopinath, Sanjay, Thorum, Matthew, Richardson, Joe, Jengyi Yu
Published in 2016 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2016)
Published in 2016 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2016)
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Conference Proceeding
An alternative approach to backside via reveal (BVR) for a via-middle through-Silicon via (TSV) flow
Jengyi Yu, Detterbeck, Stefan, CheePing Lee, Meshram, Prashant, Mountsier, Tom, Lai Wei, Qing Xu, Gopinath, Sanjay, Nalla, Praveen, Thorum, Matthew, Richardson, Joe
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Reliability study of liner/barrier/seed options for via-middle TSV's with 3 micron diameter and below
Yunlong Li, Van Huylenbroeck, Stefaan, Roussel, Philippe, Brouri, Mohand, Gopinath, Sanjay, Anjos, Daniela M., Thorum, Matthew, Jengyi Yu, Beyer, Gerald P., Beyne, Eric, Croes, Kristof
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
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Conference Proceeding
Dielectric liner reliability in via-middle through silicon vias with 3 Micron diameter
Li, Yunlong, Van Huylenbroeck, Stefaan, Roussel, Philippe, Brouri, Mohand, Gopinath, Sanjay, Anjos, Daniela M., Thorum, Matthew, Yu, Jengyi, Beyer, Gerald P., Beyne, Eric, Croes, Kristof
Published in Microelectronic engineering (20.04.2016)
Published in Microelectronic engineering (20.04.2016)
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Journal Article
Cu electromigration improvement by adhesion promotion treatment (APT)
Jengyi Yu, Hui-Jung Wu, Shaviv, R., Mountsier, T., van Schravendijk, B., Dixit, G., Gengwei Jiang, Subramonium, P., Sriram, M., Antonelli, A.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
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Conference Proceeding
Selective etch using a sacrificial mask
Li, Da, Peter, Daniel, Yu, Jengyi, Tan, Samantha SiamHwa, Kabansky, Alexander, Lee, Younghee, Nardi, Katie
Year of Publication 02.07.2024
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Year of Publication 02.07.2024
Patent
Underlayer for photoresist adhesion and dose reduction
Manumpil, Mary Anne, Li, Da, Tan, Samantha S. H, Yu, Jengyi, Xue, Jun
Year of Publication 21.05.2024
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Year of Publication 21.05.2024
Patent
REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER
Yu, Jengyi, Tan, Samantha SiamHwa, Yuan, Ge, Kanakasabapathy, Siva Krishnan, Heo, Seongjun
Year of Publication 04.04.2024
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Year of Publication 04.04.2024
Patent
ALTERNATING ETCH AND PASSIVATION PROCESS
Liang, Chen-Wei, Yu, Jengyi, Jensen, Alan J, Tan, Samantha S.H, Heo, Seongjun
Year of Publication 14.03.2024
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Year of Publication 14.03.2024
Patent
Alternating etch and passivation process
Liang, Chen-Wei, Tan, Samantha S. H, Yu, Jengyi, Jensen, Alan J, Heo, Seongjun
Year of Publication 19.12.2023
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Year of Publication 19.12.2023
Patent
Removing metal contamination from surfaces of a processing chamber
Yu, Jengyi, Tan, Samantha SiamHwa, Yuan, Ge, Kanakasabapathy, Siva Krishnan, Heo, Seongjun
Year of Publication 12.12.2023
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Year of Publication 12.12.2023
Patent
ALTERNATING ETCH AND PASSIVATION PROCESS
Liang, Chen-Wei, Yu, Jengyi, Jensen, Alan J, Tan, Samantha S.H, Heo, Seongjun
Year of Publication 22.06.2023
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Year of Publication 22.06.2023
Patent