A 5G mm-Wave Single Chip 8-channel FEM with Best-in-class 22% Power Efficiency and Embedded Die Substrate (EDS) Technology
Choi, Kyu-Jin, Yoo, Hyun-Jin, Ha, Jong-Ok, Kim, Jeong-Hoon, Kim, Jae-Sung, Jo, Byung-Hak, Kim, Se-Jong, Park, Je-Sang, Na, Yoosam, Hur, Young-Sik
Published in 2021 IEEE MTT-S International Microwave Symposium (IMS) (07.06.2021)
Published in 2021 IEEE MTT-S International Microwave Symposium (IMS) (07.06.2021)
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Conference Proceeding
Antenna module
Park, Jin Seon, So, Won Wook, Baek, Yong Ho, Hur, Young Sik, Gong, Jung Chul
Year of Publication 20.02.2024
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Year of Publication 20.02.2024
Patent
Semiconductor package
Baek, Yong Ho, Jung, Joo Hwan, Cha, Yoo Rim, Gong, Jung Chul, Hur, Young Sik
Year of Publication 20.12.2022
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Year of Publication 20.12.2022
Patent
Antenna module
So, Won Wook, Baek, Yong Ho, Kim, Doo Il, Choi, Woo Jung, Jung, Dae Kwon, Hur, Young Sik
Year of Publication 03.10.2023
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Year of Publication 03.10.2023
Patent
Bridge embedded interposer, and package substrate and semiconductor package comprising the same
Lee, Yun Tae, Yoon, Ho Kwon, Lee, Young Kwan, Cho, Jung Hyun, Hur, Young Sik
Year of Publication 01.11.2022
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Year of Publication 01.11.2022
Patent
Chip antenna module array
Lim, Dae Ki, An, Sung Yong, Han, Myeong Woo, Park, Ju Hyoung, Hur, Young Sik, Han, Kyu Bum
Year of Publication 09.05.2023
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Year of Publication 09.05.2023
Patent
Chip radio frequency package and radio frequency module
Park, Jin Seon, Kim, Hak Gu, Lee, Yong Duk, Cheon, Seong Jong, Kang, Ho Kyung, Hur, Young Sik
Year of Publication 27.12.2022
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Year of Publication 27.12.2022
Patent