Microfabrication of short pin fins on heat sink surfaces to augment heat transfer performance
Congshun Wang, Youmin Yu, Simon, T., Tianhong Cui, North, M. T.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
A parametric study of heat transfer in an air-cooled heat sink enhanced by actuated plates
Yu, Youmin, Simon, Terrence, Cui, Tianhong
Published in International journal of heat and mass transfer (01.09.2013)
Published in International journal of heat and mass transfer (01.09.2013)
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Journal Article
Comprehensive evaluation of solder paste for assembly of PQFN packages
Youmin Yu, Sean Xu, Chiriac, Victor
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
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Conference Proceeding
Effects of dispensed solder paste amount on solder void performance in a PQFN package
Youmin Yu, Yao, S.A., Sonder Wang, Weimin Chen, Jiang, Y.W.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding
Effects of reflow atmosphere on solder void and wire bond performances in a PQFN package
Youmin Yu, Yao, S.A., Lv, G.J., Wei Xiao, Sonder Wang, Jiang, Y.W., Chen, W.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding
Overview of the mechanical, thermal vacuum and EMI/EMC tests performed for the AMS-02 UTTPS space qualification campaign
Mussolin, Lorenzo, Bertucci, Bruna, Faba, Antonio, Ambrosi, Giovanni, Scolieri, Gianluca, Tissi, Francesco, Gaggiotti, Matteo, Morelli, Giulio, Zhang, Zhan, Koutsenko, Vladimir, Solano, Carlos, Kulemzin, Alexander, Yu, Youmin, Bollweg, Ken, Mott, Phillip B., Clark, Craig, Urban, Tim, Ju, Hsing, Siedenburg, Thorsten, Hoon Chung, Chan, De Angelis, Franco
Published in 2020 IEEE 20th Mediterranean Electrotechnical Conference ( MELECON) (01.06.2020)
Published in 2020 IEEE 20th Mediterranean Electrotechnical Conference ( MELECON) (01.06.2020)
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Conference Proceeding
Heat transfer apparatus and method
Agrawal Smita, Simon Terrence W, Cui Tianhong, North Mark T, Zhang Tao, Ciulla Anthony, Wood Donald, Zhu Xuelin, Huang Longzhong, Wang Congshun, Yu Youmin, Gernert Nelson, Zhang Min, Selvi Vinnee Bharathi A, Yeom Taiho
Year of Publication 16.08.2016
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Year of Publication 16.08.2016
Patent