Search Results - "YOSHII, HARUYUKI" :: K.UTB vyhledávací portál

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Liquid sealing material for coppoer bump and resin composition for use as same

by YOSHII HARUYUKI, YAMAZAWA TOMOYA
Year of Publication 04.08.2017

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LIQUID ENCAPSULATION MATERIAL FOR COPPER BUMP AND RESIN COMPOSITION USED FOR THE SAME

by YOSHII HARUYUKI, YAMAZAWA TOMOYA
Year of Publication 20.06.2016

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LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR USE AS SAME

by YOSHII HARUYUKI, YAMAZAWA TOMOYA
Year of Publication 09.06.2016

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밀봉용 액상 수지 조성물 및 전자 부품 장치

by INOUE HIDETOSHI, KAMIMURA TSUYOSHI, YOSHII HARUYUKI, MATSUZAKI TAKAYUKI, TAKAHASHI HISATO
Year of Publication 12.02.2020

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압축 성형용 액상 수지 조성물 및 전자 부품 장치

by INOUE HIDETOSHI, KAMIMURA TSUYOSHI, YOSHII HARUYUKI, MATSUZAKI TAKAYUKI, TAKAHASHI HISATO
Year of Publication 07.02.2020

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LIQUID EPOXY RESIN COMPOSITION SEMICONDUCTOR SEALING AGENT SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING LIQUID EPOXY RESIN COMPOSITION

by KOHARA KAZUYUKI, SUZUKI MAKOTO, YOSHII HARUYUKI
Year of Publication 17.08.2017

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LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE

by INOUE, Hidetoshi, TAKAHASHI, Hisato, KAMIMURA, Tsuyoshi, YOSHII, Haruyuki, MATSUZAKI, Takayuki
Year of Publication 06.12.2018

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LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE

by INOUE, Hidetoshi, TAKAHASHI, Hisato, KAMIMURA, Tsuyoshi, YOSHII, Haruyuki, MATSUZAKI, Takayuki
Year of Publication 06.12.2018

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LIQUID EPOXY RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION AGENT, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF LIQUID EPOXY RESIN COMPOSITION

by OBARA KAZUYUKI, SUZUKI MAKOTO, YOSHII HARUYUKI
Year of Publication 23.06.2016

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LIQUID EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING LIQUID EPOXY RESIN COMPOSITION

by KOHARA KAZUYUKI, SUZUKI MAKOTO, YOSHII HARUYUKI
Year of Publication 16.06.2016

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LIQUID SEALANT MATERIAL, AND ELECTRONIC DEVICE USING THE SAME

by OBARA KAZUYUKI, ISHIKAWA SEIICHI, YOSHII HARUYUKI
Year of Publication 02.06.2016

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LIQUID SEALING MATERIAL AND ELECTRONIC COMPONENT USING SAME

by KOHARA KAZUYUKI, ISHIKAWA SEIICHI, YOSHII HARUYUKI
Year of Publication 23.01.2014

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Patent

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UNDERFILL MATERIAL AND METHOD FOR MOUNTING ELECTRIC COMPONENT

by SUZUKI OSAMU, ISHIKAWA SEIICHI, YOSHII HARUYUKI
Year of Publication 14.03.2012

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UNDERFILL MATERIAL AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

by YOSHII, HARUYUKI, ISHIKAWA, SEIICHI, SUZUKI, OSAMU
Year of Publication 16.09.2010

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Preparation of Composite Particles Constituted of Fine Aluminum Nitride Powder and Polystytene by Suspension Polymerization

by KIMURA, Isao, YOSHII, Haruyuki, SAITO, Natsukaze, TANAKA, Masato
Published in Funtai Kogakkaishi (1995)

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Journal Article

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LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS

by INOUE, Hidetoshi, TAKAHASHI, Hisato, KAMIMURA, Tsuyoshi, YOSHII, Haruyuki, MATSUZAKI, Takayuki
Year of Publication 27.03.2024

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LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR USE AS SAME

by YAMAZAWA Tomoya, YOSHII Haruyuki
Year of Publication 23.11.2017

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Patent

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FLIP CHIP MOUNTING METHOD

by YOSHII, HARUYUKI, SUZUKI, KENICHI, SUZUKI, OSAMU
Year of Publication 25.10.2001

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Encapsulation of aluminum flakes by dispersion polymerization of styrene in a nonaqueous system with reactive surfactants

by Kimura, Isao, Taguchi, Yoshinari, Yoshii, Haruyuki, Tanaka, Masato
Published in Journal of applied polymer science (18.07.2001)

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Journal Article

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LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE

by INOUE, Hidetoshi, TAKAHASHI, Hisato, KAMIMURA, Tsuyoshi, YOSHII, Haruyuki, MATSUZAKI, Takayuki
Year of Publication 09.12.2020

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Patent

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