INK FOR SOLDER RESIST AND HARDENED MATERIAL THEREOF, AND PRINTED WIRING BOARD ARRANGED BY USING THE HARDENED MATERIAL
TERAMINE KENICHI, YOSHIDA YASUNARI, KUNO TOSHIMITSU, AZEYANAGI YASUHIRO, HIROTA TAKESHI, MIURA HIDEKI, SUGIMOTO TAKASHI, MATSUOKA TOMIZO
Year of Publication 15.12.2014
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Year of Publication 15.12.2014
Patent