Fine pitch PoP introduction
Kim, Jinseong, Han, Gyuwan, Cho, Byoungwoo, Ahn, Yesul, Park, Dongjoo, Yoon, Juhoon, Lee, Choonheung, Yoshida, Akito
Published in 2013 3rd IEEE CPMT Symposium Japan (01.11.2013)
Published in 2013 3rd IEEE CPMT Symposium Japan (01.11.2013)
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Conference Proceeding
Electronic devices and methods of manufacturing electronic devices
SIEW, GLEN, RYU, DONG-SU, YOSHIDA, AKITO, KONG, MIN-JAE, BAE, JO-HYUN
Year of Publication 01.01.2024
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Year of Publication 01.01.2024
Patent
High Density PoP (Package-on-Package) and Package Stacking Development
Dreiza, M., Yoshida, A., Ishibashi, K., Maeda, T.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding