Kinetic Monte Carlo Modeling of Boron Diffusion in Strained Silicon
Kim, Young-Kyu, Yoon, Kwan-Sun, Kim, Joong-Sik, Won, Taeyoung
Published in Japanese Journal of Applied Physics (01.04.2007)
Published in Japanese Journal of Applied Physics (01.04.2007)
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Journal Article
Atomistic modelling for boron diffusion in strained silicon substrate
Kim, Young-Kyu, Yoon, Kwan-Sun, Kim, Joong-Sik, Kim, Han-Geon, Won, Taeyoung
Published in Molecular simulation (01.01.2008)
Published in Molecular simulation (01.01.2008)
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Journal Article
METHOD OF FABRICATING A CIRCUIT BOARD
PARK, JIN YOUNG, YOON, KWAN SUN, PARK, JONG YOUNG, LEE, MIN WOO, SHIRAI SEIJI
Year of Publication 16.06.2017
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Year of Publication 16.06.2017
Patent
Study on Advanced Substrate for Double-side Package to Reduce Module Size
Kim, Ji-Hee, Yoon, Kwan-Sun, Oh, Hwa-Dong, Ahn, Eun-Chul, Shin, Young-Hwan, Kim, Young-Jae
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Adhesion Strength and Warpage Behaviors of Advanced Package Substrate by Light-source Irradiation
Park, Jong-Young, Ahn, Eun-Chul, Youm, Kwang-Seop, Yoon, Kwan-Sun, Shin, Young-Hwan, Noh, Joo-Hyoung, Kim, Young-Jae
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
METHOD OF MANUFACTURING COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD
LEE, MIN SEOK, LEE, HAN SUNG, LEE, YONG BIN, YOON, KWAN SUN, KO, YOUNG JOO
Year of Publication 16.01.2014
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Year of Publication 16.01.2014
Patent