Fenton Reaction for Enhancing Polishing Rate and Protonated Amine Functional Group Polymer for Inhibiting Corrosion in Ge1Sb4Te5 Film Surface Chemical-Mechanical-Planarization
Jeong, Gi-Ppeum, Son, Young-Hye, Park, Jun-Seong, Kim, Pil-Su, Han, Man-Hyup, Hong, Seong-Wan, Park, Jin-Hyung, Cui, Hao, Yoon, Bo-Un, Park, Jea-Gun
Published in Applied sciences (01.11.2021)
Published in Applied sciences (01.11.2021)
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Journal Article
Characterization and removal of polysilicon residue during wet etching
Ko, Kihyung, Song, Myung-Geun, Jeon, Hayoung, Han, Jungnam, Yoon, Bo Un, Koh, Yongsun, Ahn, Chisung, Kim, Taesung
Published in Microelectronic engineering (05.01.2016)
Published in Microelectronic engineering (05.01.2016)
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Journal Article
Effect of Polysilicon Wettability on Polishing and Organic Defects during CMP
Park, Jin-Goo, Prasad, Y. Nagendra, Kang, Young-Jae, Kim, In-Kwon, Hong, Yi-Koan, Han, Sang-Yeob, Yun, Seong-Kyu, Yoon, Bo-Un, Busnaina, Ahmed A.
Published in Journal of the Electrochemical Society (2009)
Published in Journal of the Electrochemical Society (2009)
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Journal Article
In situ Scanning Tunneling Microscopy of the Electrochemical Deposition of Ag on Graphite
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Journal Article
Conference Proceeding
Effect of Wettability of Silicon and Poly Silicon on Polishing Performance
Kang, Young-Jae, Kang, Bong-Kyun, Park, Jin-Goo, Hong, Yi-Koan, Han, Sang-Yeob, Yun, Seong-Kyu, Yoon, Bo-Un, Hong, Chang-Ki
Published in ECS transactions (24.10.2008)
Published in ECS transactions (24.10.2008)
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Journal Article
An eddy current sensor for end-point detection in chemical mechanical planarization using composition signal filtration and a digital potentiometer
Oh, Seungjun, Kim, Eungchul, An, Hyunmo, Yoon, Bo-un, Jang, Kihoon, Kwon, Donghoon, Cho, Wonkeun, Kim, Taesung
Published in Materials science in semiconductor processing (01.10.2024)
Published in Materials science in semiconductor processing (01.10.2024)
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Journal Article
Origins of wear-induced tungsten corrosion defects in semiconductor manufacturing during tungsten chemical mechanical polishing
Choi, Seung-Hoon, Kreider, Melissa E., Nielander, Adam C., Stevens, Michaela Burke, Kamat, Gaurav, Koo, Ja Eung, Bae, Ki Ho, Kim, Hoyoung, Yoon, Il Young, Yoon, Bo Un, Hwang, Kihyun, Lee, Dong Un, Jaramillo, Thomas F.
Published in Applied surface science (01.10.2022)
Published in Applied surface science (01.10.2022)
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Journal Article
Highly selective chemical mechanical polishing of Si3N4 over SiO2 using advanced silica abrasive
Bae, KiHo, Baek, Kye Hyun, Kim, JaeSeok, Kim, Hoyoung, Yoon, Bo Un, Kim, Jae Jeong
Published in Japanese Journal of Applied Physics (01.05.2017)
Published in Japanese Journal of Applied Physics (01.05.2017)
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Journal Article
Retardation Phenomenon of Oxide Removal during the Formation of Dual Gate Oxide via PR-Mask Wet Etching
Song, Myung Geun, Yoon, Bo Un, Ko, Ki Hyung, Cho, Byung Kwon, Cho, Yu Jin, Kim, Tae Sung
Published in Solid state phenomena (01.09.2014)
Published in Solid state phenomena (01.09.2014)
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Journal Article
Formation of Dendrite-Like Defect during PR-Mask Silicon Oxide Wet Etching Process and Its Removal Method
Song, Myung-Geun, Yoon, Bo Un, Lee, Kun-Tack, Choi, Si-Young
Published in ECS solid state letters (13.08.2013)
Published in ECS solid state letters (13.08.2013)
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Journal Article
Chemical Mechanical Planarization Technology for Si Wafer Bonding
Lim, JongHeun, Yoon, BoUn, Kim, KyungHyun, Ko, YoungSun, Kang, ChangJin
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
Effect of Poly Silicon Wettability on Polymeric Residue Contamination
Kang, Young-Jae, Park, Jin-Goo, Hong, Yi-Koan, Han, Sang-Yeob, Yun, Seong-Kyu, Yoon, Bo-Un, Hong, ChangKi
Published in ECS transactions (28.09.2007)
Published in ECS transactions (28.09.2007)
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Journal Article
Methods of manufacturing semiconductor devices
Yoon, Bo Un, Bae, Jin Woo, Park, Jong Hyuk, Yoon, Il Young, Choi, Bong Sik, Park, Hye Sung
Year of Publication 14.02.2023
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Year of Publication 14.02.2023
Patent
Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
Koo, Ja Eung, Earmme, Tae Min, Seo, Hyun Kyo, Yoon, Bo Un, Choi, Seung Hoon, Jeong, Youn Cheol, Kim, No Ui
Year of Publication 17.10.2023
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Year of Publication 17.10.2023
Patent