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Impact of Depression on Work Productivity and Its Improvement after Outpatient Treatment with Antidepressants

Impact of Depression on Work Productivity and Its Improvement after Outpatient Treatment with Antidepressants

by Woo, Jong-Min, MD, MPH, PhD, Kim, Won, MD, PhD, Hwang, Tae-Yeon, MD, PhD, Frick, Kevin D., PhD, Choi, Byong Hwi, MD, Seo, Yong-Jin, MD, Kang, Eun-Ho, MD, Kim, Se Joo, MD, PhD, Ham, Byong-Joo, MD, PhD, Lee, Jun-Seok, MD, PhD, Park, Yu Lee, OMD, MPH
Published in Value in health (01.06.2011)

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Journal Article

Design of Various Dipolar Source for Improvement of Electrostatic Discharge Protection Performance of 0.18 μm_30 V DDDNMOS Transistor for High Voltage Application

Design of Various Dipolar Source for Improvement of Electrostatic Discharge Protection Performance of 0.18 μm_30 V DDDNMOS Transistor for High Voltage Application

by Seo, Yong-Jin
Published in Journal of semiconductor technology and science (01.06.2024)

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Journal Article

Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions

Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions

by Kim, Nam-Hoon, Seo, Yong-Jin, Lee, Woo-Sun
Published in Microelectronic engineering (01.02.2006)

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Journal Article

Methodological Consideration on the Prediction of Electrochemical Mechanical Polishing Process Parameters by Monitoring of Electrochemical Characteristics of Copper Surface

Methodological Consideration on the Prediction of Electrochemical Mechanical Polishing Process Parameters by Monitoring of Electrochemical Characteristics of Copper Surface

by Seo, Yong-Jin
Published in Journal of Electrochemical Science and Technology (01.11.2020)

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Journal Article

Chemical mechanical polishing of PZT thin films for FRAM applications

Chemical mechanical polishing of PZT thin films for FRAM applications

by Seo, Yong-Jin, Park, Jin-Seong, Woo-Sun Lee
Published in Microelectronic engineering (01.11.2006)

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Journal Article Conference Proceeding

Voltage-induced material removal mechanism of copper for electrochemical-mechanical polishing applications

Voltage-induced material removal mechanism of copper for electrochemical-mechanical polishing applications

by HAN, Sang-Jun, SEO, Yong-Jin
Published in Transactions of Nonferrous Metals Society of China (01.09.2009)

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Journal Article

Structural and surface properties of NiCr thin films prepared by DC magnetron sputtering under variation of annealing conditions

Structural and surface properties of NiCr thin films prepared by DC magnetron sputtering under variation of annealing conditions

by Kwon, Yong, Kim, Nam-Hoon, Choi, Gwang-Pyo, Lee, Woo-Sun, Seo, Yong-Jin, Park, Jinseong
Published in Microelectronic engineering (01.12.2005)

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Journal Article Conference Proceeding

Effects of oxidant additives for exact selectivity control of W- and Ti-CMP process

Effects of oxidant additives for exact selectivity control of W- and Ti-CMP process

by Seo, Yong-Jin, Lee, Woo-Sun
Published in Microelectronic engineering (01.02.2005)

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Journal Article

Electrochemical–mechanical polishing application: Monitoring of electrochemical copper removal from current–voltage characteristics in HNO 3 electrolyte

Electrochemical–mechanical polishing application: Monitoring of electrochemical copper removal from current–voltage characteristics in HNO 3 electrolyte

by Seo, Yong-Jin
Published in Microelectronic engineering (2011)

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Journal Article

Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density

Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density

by Seo, Yong-Jin, Kim, Sang-Yong, Choi, Yeon-Ok, Oh, Yong-Taek, Lee, Woo-Sun
Published in Materials letters (01.06.2004)

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Journal Article

Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation–chemical–mechanical polishing (STI–CMP) process

Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation–chemical–mechanical polishing (STI–CMP) process

by Kim, Sang-Yong, Seo, Yong-Jin
Published in Microelectronic engineering (01.04.2002)

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Journal Article

CMP properties and fabrication of OLED using MEH-PPV

CMP properties and fabrication of OLED using MEH-PPV

by Lee, Woo-Sun, Choi, Gwon-Woo, Seo, Yong-Jin
Published in Physica status solidi. C (01.08.2008)

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Journal Article

Effect of diluted colloidal silica slurry mixed with ceria abrasives on CMP characteristic

Effect of diluted colloidal silica slurry mixed with ceria abrasives on CMP characteristic

by Lee, Youngkyun, Seo, Yong-Jin, Lee, Hojun, Jeong, Haedo
Published in International Journal of Precision Engineering and Manufacturing-Green Technology (2016)

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Journal Article

N-Type Extended Drain Silicon Controlled Rectifier Electrostatic Discharge Protection Device for High-Voltage Operating Input/Output Applications

N-Type Extended Drain Silicon Controlled Rectifier Electrostatic Discharge Protection Device for High-Voltage Operating Input/Output Applications

by Seo, Yong-Jin, Kim, Kil-Ho
Published in Japanese Journal of Applied Physics (01.04.2007)

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Journal Article

Long-term treatment with long-acting risperidone in Korean patients with schizophrenia

Long-term treatment with long-acting risperidone in Korean patients with schizophrenia

by Lee, Moon-Soo, Ko, Young-Hoon, Lee, Sang-Hoon, Seo, Yong-Jin, Kim, Seung-Hyun, Joe, Sook-Haeng, Han, Chang-Su, Lee, Jung-Ho, Jung, In-Kwa
Published in Human psychopharmacology (01.08.2006)

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Journal Article

Effects of STI-fill thickness on the CMP process defects

Effects of STI-fill thickness on the CMP process defects

by Seo, Yong-Jin, Kim, Gi-Uk, Lee, Woo-Sun
Published in Microelectronic engineering (01.02.2004)

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Journal Article

Reduction of process defects using a modified set-up for chemical mechanical polishing equipment

Reduction of process defects using a modified set-up for chemical mechanical polishing equipment

by Seo, Yong-Jin, Kim, Sang-Yong, Lee, Woo-Sun
Published in Microelectronic engineering (01.05.2003)

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Journal Article

Motor-Current-Based Real-Time End Point Detection of Shallow-Trench-Isolation Chemical Mechanical Polishing Process Using High-Selectivity Slurry

Motor-Current-Based Real-Time End Point Detection of Shallow-Trench-Isolation Chemical Mechanical Polishing Process Using High-Selectivity Slurry

by Seo, Yong-Jin, Lee, Woo-Sun, Park, Jin-Seong, Kim, Sang-Yong
Published in Japanese Journal of Applied Physics (01.10.2003)

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Journal Article

Prevention of plasma-induced damage during HDP–CVD deposition

Prevention of plasma-induced damage during HDP–CVD deposition

by Kim, Sang-Yong, Lee, Woo-Sun, Seo, Yong-Jin
Published in Journal of materials processing technology (10.04.2004)

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Journal Article

Chemical mechanical polishing performances by filtering and retreatment of used silica abrasives slurry

Chemical mechanical polishing performances by filtering and retreatment of used silica abrasives slurry

by Seo, Yong-Jin, Park, Sung-Woo, Kim, Nam-Hoon, Chang, Eui-Goo, Lee, Woo-Sun
Published in Microelectronic engineering (01.04.2005)

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Journal Article

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