Improve signal integrity performance by using hybrid PCB stackup
Mendez Ruiz, Cesar, Chunfei Ye, Xiaoning Ye, Lopez, Enrique, Maoxin Yin, Hsu, Jimmy, Su, Thonas
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
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Conference Proceeding
Optimal Design of Shock Absorption for Hexapod Robot based on Magnetorheological Fluid
Huang, Sihao, Chen, Boyang, Yin, Maoxin, Ren, Yiming, Xie, Zikang
Published in Journal of physics. Conference series (01.10.2022)
Published in Journal of physics. Conference series (01.10.2022)
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Journal Article
Application of hybrid PCB stackup
Yinglei Ren, Maoxin Yin, Chunfei Ye, Xiaoning Ye
Published in 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2017)
Published in 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2017)
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Conference Proceeding
Enhancing Chinese Event Causality Identification with Supervised Contrastive Learning
Yin, Maoxin, Chen, Yuheng, Qian, Huixun, Liu, Haifeng, Zhou, Junsheng
Published in 2023 IEEE 9th International Conference on Cloud Computing and Intelligent Systems (CCIS) (12.08.2023)
Published in 2023 IEEE 9th International Conference on Cloud Computing and Intelligent Systems (CCIS) (12.08.2023)
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Conference Proceeding
HIGH-DENSITY SOCKET CONNECTORS
SMALLEY, Jeffory, ZHANG, Zhichao, YIN, Maoxin, ZENG, Yi, ZHANG, Xinjun, DU, Lianchang, NEKKANTY, Srikant
Year of Publication 04.04.2024
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Year of Publication 04.04.2024
Patent
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING SIDE I/OS
BUDDRIUS, Eric W, LU, Jun, FAN, Yuehong, YIN, Maoxin, REN, Yinglei, ZHANG, Chen, DU, Lianchang, WANG, Kai, HANNA, Timothy Glen, NEKKANTY, Srikant, FENG, Lijuan, ZHANG, Zhichao, ZHAO, Chong J, BODDU, Vijaya K, SCHMISSEUR, Mark A, ZENG, Yi, ZHOU, Mingli, ZHANG, Xinjun, YING, Guoliang, SMALLEY, Jeffory L
Year of Publication 23.10.2024
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Year of Publication 23.10.2024
Patent
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING SIDE I/OS
BUDDRIUS, Eric W, LU, Jun, FAN, Yuehong, YIN, Maoxin, REN, Yinglei, ZHANG, Chen, DU, Lianchang, WANG, Kai, HANNA, Timothy Glen, NEKKANTY, Srikant, FENG, Lijuan, ZHANG, Zhichao, ZHAO, Chong J, BODDU, Vijaya K, SCHMISSEUR, Mark A, ZENG, Yi, ZHOU, Mingli, ZHANG, Xinjun, YING, Guoliang, SMALLEY, Jeffory L
Year of Publication 22.06.2023
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Year of Publication 22.06.2023
Patent