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"YIM Myung Jin"
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"YIM Myung Jin"
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Halbleitergehäuse mit eingebettetem optischem Die
by
Raghunathan, Vivek
,
Yim
,
Myung Jin
Year of Publication
28.03.2019
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122
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Methods for fabricating integrated circuit systems including high reliability die under-fill
by
YIM
,
MYUNG JIN
Year of Publication
01.07.2017
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Forming a carbon nano-tube dispersion
by
BRAND JASON M
,
YIM MYUNG
,
JIN
Year of Publication
03.09.2015
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OPTOELECTRONIC PACKAGING ASSEMBLIES
by
YIM
,
MYUNG
,
JIN
,
YEPANECHNIKOV, VALENTIN
,
LIU, ANSHENG
Year of Publication
02.07.2015
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125
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INTEGRATED CIRCUIT WITH CHIP-ON-CHIP AND CHIP-ON-SUBSTRATE CONFIGURATION
by
LIU, Ansheng
,
YIM
,
Myung Jin
,
DOSUNMU, Olufemi I
Year of Publication
08.06.2017
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126
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INTEGRATED CIRCUIT WITH CHIP-ON-CHIP AND CHIP-ON-SUBSTRATE CONFIGURATION
by
Dosunmu Olufemi I
,
Liu Ansheng
,
Yim Myung Jin
Year of Publication
01.06.2017
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127
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DYNAMIC BEAM STEERING OPTOELECTRONIC PACKAGES
by
KIM WOOSUNG
,
YIM MYUNG JIN
Year of Publication
23.10.2018
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128
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Multi-die building block for stacked-die package
by
ADIMULA RAVIKUMAR
,
YIM MYUNG JIN
Year of Publication
01.01.2013
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129
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Multi-die building block for stacked-die package
by
Adimula, Ravikumar
,
Yim
,
Myung Jin
Year of Publication
01.01.2013
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PROTECTIVE THIN FILM COATING IN CHIP PACKAGING
by
YIM MYUNG JIN
Year of Publication
01.07.2010
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131
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METHOD OF FABRICATING AN OPTICAL MODULE THAT INCLUDES AN ELECTRONIC PACKAGE
by
HONG, Jong-Min
,
YIM
,
Myung Jin
,
LEE, Jay, S
Year of Publication
29.09.2016
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PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BETWEEN THE PACKAGE AND A SUBSTRATE OR ANOTHER PACKAGE
by
QUEVEDO NANETTE
,
YIM MYUNG JIN
,
STRODE RICHARD
Year of Publication
03.10.2013
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Integrated circuit assembly with chip-on-chip and chip-on-substrate configuration, method for forming the same and computing apparatus
by
DOSUNMU, OLUFEMI I
,
YIM
,
MYUNG JIN
,
LIU, ANSHENG
Year of Publication
11.11.2020
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Package including an underfill material in a portion of an area between the package and a substrate or another package
by
QUEVEDO NANETTE
,
YIM MYUNG JIN
,
STRODE RICHARD
Year of Publication
28.05.2013
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Methods for fabricating integrated circuit systems
by
YIM
,
MYUNG JIN
Year of Publication
11.01.2015
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Vinasse ammonification technology
by
LIU YUNFEI
,
LEI HEXIAN
,
YIM MYUNG JIN
,
LI HUALEI
,
YANG ZHE
Year of Publication
25.03.2022
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MULTI-DIE BUILDING BLOCK FOR STACKED-DIE PACKAGE
by
ADIMULA RAVIKUMAR
,
YIM MYUNG JIN
Year of Publication
01.07.2010
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SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS
by
ADIMULA RAVIKUMAR
,
YIM MYUNG JIN
Year of Publication
01.07.2010
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139
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MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION
by
YIM MYUNG JIN
,
BRAND JASON
Year of Publication
24.06.2010
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Package on Package Assembly using Electrically Conductive Adhesive Material
by
QUEVEDO NANETTE
,
YIM MYUNG JIN
Year of Publication
17.06.2010
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