Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill
Sangil Lee, Myung Jin Yim, Master, R.N., Wong, C.P., Baldwin, D.F.
Published in IEEE transactions on electronics packaging manufacturing (01.04.2009)
Published in IEEE transactions on electronics packaging manufacturing (01.04.2009)
Get full text
Journal Article
Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)
SON, Ho-Young, CHUNG, Chang-Kyu, YIM, Myung-Jin, HWANG, Jin-Sang, PAIK, Kyung-Wook, JUNG, Gi-Jo, LEE, Jun-Kyu
Published in IEEE transactions on electronics packaging manufacturing (01.07.2007)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2007)
Get full text
Journal Article
Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications
Myung Jin Yim, Myung Jin Yim, In Ho Jeong, In Ho Jeong, Hyung-Kyu Choi, Hyung-Kyu Choi, Jin-Sang Hwang, Jin-Sang Hwang, Jin-Yong Ahn, Jin-Yong Ahn, Woonseong Kwon, Woonseong Kwon, Kyung-Wook Paik, Kyung-Wook Paik
Published in IEEE transactions on components and packaging technologies (01.12.2005)
Published in IEEE transactions on components and packaging technologies (01.12.2005)
Get full text
Journal Article
Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill
Aggarwal, A.O., Raj, P.M., Baik-Woo Lee, Myung Jin Yim, Iyer, M., Wong, C.P., Tummala, R.R.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2008)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2008)
Get full text
Journal Article
Enhanced Electrical Properties of Anisotropic Conductive Adhesive With [Formula Omitted]-Conjugated Self-Assembled Molecular Wire Junctions
Rongwei Zhang, Rongwei Zhang, Yi Li, Yi Li, Myung Jin Yim, Myung Jin Yim, Kyoung Sik Moon, Kyoung Sik Moon, Lu, D.D, Wong, C.P
Published in IEEE transactions on components and packaging technologies (01.09.2009)
Published in IEEE transactions on components and packaging technologies (01.09.2009)
Get full text
Journal Article
Study of the formation of bubbles in rigid substrate-flexible substrate bonding using anisotropic conductive films and the bubble effects on anisotropic conductive film joint reliability
KIM, Hyoung-Joon, CHUNG, Chang-Kyu, KWON, Yong-Min, YIM, Myung-Jin, HONG, Soon-Min, JANG, Se-Young, MOON, Young-Joon, PAIK, Kyung-Wook
Published in Journal of electronic materials (01.01.2007)
Published in Journal of electronic materials (01.01.2007)
Get full text
Journal Article
Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives
MYUNG JIN YIM, YI LI, KYOUNG SIK MOON, WONG, C. P
Published in Journal of electronic materials (01.10.2007)
Published in Journal of electronic materials (01.10.2007)
Get full text
Journal Article
Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications
Jang, K.-W., Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik
Published in IEEE transactions on components and packaging technologies (01.09.2004)
Published in IEEE transactions on components and packaging technologies (01.09.2004)
Get full text
Journal Article
Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Get full text
Journal Article