Wafer level packaging for MEMS device
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Year of Publication 28.05.2019
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WAFER LEVEL PACKAGING FOR MEMS DEVICE
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Year of Publication 16.05.2019
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Wafer level packaging for mems device
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Year of Publication 11.04.2020
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Year of Publication 11.04.2020
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Wafer level packaging for MEMS device
YIK, CHUN HOE, YELEHANKA, PRADEEP, RAJASEKARAN, NATARAJAN, CHAKRAVARTY, SIDDHARTH, KUMAR, RAKESH, POIKAYIL SATHEESH, SHARATH POIKAYIL
Year of Publication 01.08.2019
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Year of Publication 01.08.2019
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WAFER LEVEL PACKAGING FOR MEMS DEVICE
YIK CHUN-HOE, RAJASEKARAN NATARAJAN, POIKAYIL SATHEESH SHARATH POIKAYIL, YELEHANKA PRADEEP, CHAKRAVARTY SIDDHARTH, KUMAR RAKESH
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Year of Publication 21.05.2019
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CMOS compatible wafer bonding layer and process
JIAQI WU, RAKESH KUMAR, KIA HWEE SAMUEL LOW, RANGANATHAN NAGARAJAN, PRADEEP RAMACHANDRAMURTHY YELEHANKA, CHUN HOE YIK, JINGZE TIAN, FU CHUEN TAN
Year of Publication 25.02.2015
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Year of Publication 25.02.2015
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CMOS COMPATIBLE WAFER BONDING LAYER AND PROCESS
LOW KIA HWEE SAMUEL, NAGARAJAN RANGANATHAN, TIAN JINGZE, TAN FU CHUEN, YELEHANKA PRADEEP RAMACHANDRAMURTHY, YIK CHUN HOE, WU JIAQI, KUMAR RAKESH
Year of Publication 19.02.2015
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Year of Publication 19.02.2015
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Cmos compatible wafer bonding layer and process
LOW, KIA HWEE SAMUEL, YIK, CHUN HOE, YELEHANKA, PRADEEP RAMACHANDRAMURTHY, TIAN, JINGZE, WU, JIAQI, NAGARAJAN, RANGANATHAN, KUMAR, RAKESH, TAN, FU CHUEN
Year of Publication 01.08.2017
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Year of Publication 01.08.2017
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CMOS compatible wafer bonding layer and process
LOW, KIA HWEE SAMUEL, YIK, CHUN HOE, YELEHANKA, PRADEEP RAMACHANDRAMURTHY, TIAN, JINGZE, WU, JIA-QI, NAGARAJAN, RANGANATHAN, KUMAR, RAKESH, TAN, FU CHUEN
Year of Publication 16.07.2015
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Year of Publication 16.07.2015
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