A thermo mechanical finite element modeling approach to solving stress induced passivation failures
Mirza, Fahad, Khor, E. E. Jan, Fook Hong Lee, Premachandran, C. S., Wanbing Yi, Juan Boon Tan, Graas, Carole, Justison, Patrick
Published in 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2016)
Published in 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2016)
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Conference Proceeding
Integration challenges of low temperature BEOL interconnects
Bhushan, Bharat, Yi Jiang, Wanbing Yi, Juan Boon Tan, Zhehui Wang, Chin Chuan Neo, Guoqing Lin, Kah Wee, Ju Dy, Yew Tuck Chow, Poh, Francis, Shum, Danny, Nagel, Kerry, Deshpande, Sarin, Hossain, Moazzem, Aggarwal, Sanjeev
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
Insights on Inter-metal Reliability Assessment of High Voltage Interconnects
Yew, Kwang Sing, Ong, Ran Xing, Yap, Hin Kiong, Yi, Wanbing, Phang, Jacquelyn, Chockalingam, R., Tan, Juan Boon
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
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Conference Proceeding
Impact of pattern density on copper interconnects barrier metal liner integrity
Wanbing Yi, Daxiang Wang, Kemao Lin, Shaoqiang Zhang, Juan Boon Tan
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Published in IEEE International Interconnect Technology Conference (01.05.2014)
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Conference Proceeding
Interconnects Variability Control for High Voltage Applications
Yew, Kwang Sing, Jiang, Yi, Yi, Wanbing, Chockalingam, Ramasamy, Ong, Ran Xing, Li, Bo, Tan, Juan Boon
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
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Conference Proceeding
LAYER STACKS FOR A RESISTIVE MEMORY ELEMENT
Hsieh, Curtis Chun-I, Yi, Wanbing, Sun, Yongshun, Kang, Kai, Tan, Juan Boon, Toh, Eng-Huat
Year of Publication 08.08.2024
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Year of Publication 08.08.2024
Patent
Memory devices and methods of forming the same
Hsieh, Curtis Chun-I, Yi, Wanbing, Jiang, Yi, Kang, Kai, Tan, Juan Boon, Hsu, Wei-Hui
Year of Publication 07.05.2024
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Year of Publication 07.05.2024
Patent
Memory cells and methods for forming memory cells
Hsieh, Curtis Chun-I, Yi, Wanbing, Jiang, Yi, Leong, Lup San, Tan, Juan Boon, Lin, Benfu
Year of Publication 02.05.2023
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Year of Publication 02.05.2023
Patent
Analysis of Extreme Pattern Density and Interconnects Routing Impacts on Via Open
Jiang, Yi, Yew, Kwang Sing, Lin, Kemao, Cheng, Weining, Hsieh, Curtis, Ong, Jonathan, Yi, Wanbing, Chockalingam, Ramasamy, Siah, Soh Yun, Boon Tan, Juan
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
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Conference Proceeding
Resistive random access memory devices
Hsieh, Curtis Chun-I, Yi, Wanbing, Jiang, Yi, Kang, Kai, Tan, Juan Boon, Hsu, Wei-Hui
Year of Publication 29.11.2022
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Year of Publication 29.11.2022
Patent
Semiconductor devices and methods of forming semiconductor devices
Hsieh, Curtis Chun-I, Yi, Wanbing, Jiang, Yi, Kang, Kai, Tan, Juan Boon
Year of Publication 08.03.2022
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Year of Publication 08.03.2022
Patent