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"YI, Fengliang"
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"YI, Fengliang"
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Circuit board, photosensitive assembly and camera module
by
YI FENGLIANG
,
HUANG HUA
,
FU LEI
Year of Publication
07.03.2023
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Photosensitive component, camera module and corresponding manufacturing method
by
XU CHENXIANG
,
YI FENGLIANG
,
SUN ZHANPEI
,
HUANG ZHEN
,
BAO JI
Year of Publication
15.09.2023
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Molded photosensitive component, camera module and manufacturing method of molded photosensitive component
by
YI FENGLIANG
,
RUAN DINGJIE
,
LU BIN
,
BAO JI
Year of Publication
15.09.2023
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Camera module
by
XU CHENXIANG
,
YI FENGLIANG
,
LU XISONG
,
YU JIE
Year of Publication
12.09.2023
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Photosensitive component and electric conduction method thereof
by
LI CHENGHUI
,
YI FENGLIANG
,
HUANG ZHEN
,
YU JIE
Year of Publication
12.09.2023
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Photosensitive component and preparation method thereof
by
YI FENGLIANG
,
YANG GUANGCHANG
,
LU XISONG
,
YU JIE
Year of Publication
12.09.2023
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Camera module
by
LI CHENGHUI
,
YI FENGLIANG
,
LU XISONG
,
YU JIE
Year of Publication
12.09.2023
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PHOTOSENSITIVE ASSEMBLY AND ELECTRICAL CONNECTION METHOD AND PREPARATION METHOD THEREFOR, AND CAMERA MODULE
by
YI
,
Fengliang
,
LU, Xisong
,
XU, Chenxiang
,
YU, Jie
Year of Publication
07.09.2023
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Camera module and manufacturing method thereof
by
YI FENGLIANG
,
LI CHENGHUI
,
XU YUANXIAO
,
LU XISONG
,
YU JIE
Year of Publication
09.02.2024
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Camera module and manufacturing method thereof
by
LI CHENGHUI
,
YI FENGLIANG
,
LEE WON-JANG
,
BAO JI
,
YU JIE
Year of Publication
06.02.2024
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Camera module and electronic equipment thereof
by
YI FENGLIANG
,
ZHAO BOJIE
,
QUE JIAYAO
,
ZHOU JI
,
YU JIE
Year of Publication
30.12.2022
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Camera module and manufacturing method thereof
by
YI FENGLIANG
,
ZHAO BOJIE
,
QUE JIAYAO
,
ZHOU JI
,
YU JIE
Year of Publication
30.12.2022
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Camera module and molded circuit board thereof
by
FENG XINRU
,
YI FENGLIANG
,
LI CHENGHUI
,
HUANG ZHEN
,
LU XISONG
,
YU JIE
Year of Publication
14.07.2023
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Circuit board jointed board, manufacturing method thereof, photosensitive assembly and camera module
by
YI FENGLIANG
,
XI FENGSHENG
,
HUANG HUA
Year of Publication
09.06.2020
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Photosensitive component, preparation method thereof and camera module
by
YI FENGLIANG
,
DING LIANG
,
LU XISONG
,
BAO JI
,
YU JIE
Year of Publication
20.12.2022
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Copper-clad jointed board and preparation method of camera module
by
YI FENGLIANG
,
XI FENGSHENG
,
WANG DONGJU
,
LUAN ZHONGYU
,
WANG QINGJIE
Year of Publication
01.12.2020
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Circuit board procesing method
by
YI FENGLIANG
,
GUO WEI
,
WANG YAFEI
Year of Publication
18.12.2018
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Reflow soldering carrier
by
YI FENGLIANG
,
GUO WEI
,
WANG YAFEI
Year of Publication
18.12.2018
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CIRCUIT BOARD PANEL, MANUFACTURING METHOD THEREFOR, PHOTOSENSITIVE COMPONENT AND CAMERA MODULE
by
HUANG, Hua
,
YI
,
Fengliang
,
XI, Fengsheng
,
HUO, Lili
,
GUO, Fei
Year of Publication
04.06.2020
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Camera module
by
YI FENGLIANG
,
WU YE
,
WANG YAFEI
Year of Publication
18.12.2018
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casings or constructional details of electric apparatus
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