Electroless atomic layer deposition of copper
Venkatraman, Kailash, Joi, Aniruddha, Dordi, Yezdi, Akolkar, Rohan
Published in Electrochemistry communications (01.06.2018)
Published in Electrochemistry communications (01.06.2018)
Get full text
Journal Article
Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc
Venkatraman, Kailash, Gusley, Ryan, Yu, Lu, Dordi, Yezdi, Akolkar, Rohan
Published in Journal of the Electrochemical Society (01.01.2016)
Published in Journal of the Electrochemical Society (01.01.2016)
Get full text
Journal Article
Electroless Platinum Deposition Using Co3+/Co2+ Redox Couple as a Reducing Agent
Tamasauskaite-Tamasiunaite, Loreta, Dordi, Yezdi, Norkus, Eugenijus, Stankeviciene, Ina, Jagminiene, Aldona, Naujokaitis, Arnas, Tumonis, Liudas, Buzas, Vytenis, Maciulis, Laurynas
Published in Materials (10.04.2021)
Published in Materials (10.04.2021)
Get full text
Journal Article
Deposition of Copper on Ruthenium for Cu Metallization
Kelly, James, Van der Straten, O., Vo, Tuan, Janek, Richard, Dordi, Yezdi
Published in ECS transactions (01.10.2010)
Published in ECS transactions (01.10.2010)
Get full text
Journal Article
Investigation of RuZn alloy as barrier to Cu interconnect
Wang, Peng, Qu, Xin-Ping, Dordi, Yezdi, Joi, Aniruddha
Published in Journal of materials science. Materials in electronics (01.03.2022)
Published in Journal of materials science. Materials in electronics (01.03.2022)
Get full text
Journal Article
Electroless Deposition of Pb Monolayer: A New Process and Application to Surface Selective Atomic Layer Deposition
Wu, Dongjun, Solanki, Dhaivat J, Ramirez, J. Luis, Yang, Wenli, Joi, Aniruddha, Dordi, Yezdi, Dole, Nikhil, Brankovic, Stanko R
Published in Langmuir (25.09.2018)
Published in Langmuir (25.09.2018)
Get full text
Journal Article
Electroless Platinum Deposition Using Co 3+ /Co 2+ Redox Couple as a Reducing Agent
Tamasauskaite-Tamasiunaite, Loreta, Dordi, Yezdi, Norkus, Eugenijus, Stankeviciene, Ina, Jagminiene, Aldona, Naujokaitis, Arnas, Tumonis, Liudas, Buzas, Vytenis, Maciulis, Laurynas
Published in Materials (10.04.2021)
Get full text
Published in Materials (10.04.2021)
Journal Article
Pulse electrodeposition of copper-manganese alloy in deep eutectic solvent
Chiang, Wei-Shen, Huang, Jun-Qian, Chen, Po-Chun, Wu, Pu-Wei, Joi, Aniruddha, Dordi, Yezdi
Published in Journal of alloys and compounds (25.04.2018)
Published in Journal of alloys and compounds (25.04.2018)
Get full text
Journal Article
Editors' Choice-Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes
Joi, Aniruddha, Venkatraman, Kailash, Tso, Kuang-Chih, Dictus, Dries, Dordi, Yezdi, Wu, Pu-Wei, Pao, Chih-Wen, Akolkar, Rohan
Published in ECS journal of solid state science and technology (01.01.2019)
Published in ECS journal of solid state science and technology (01.01.2019)
Get full text
Journal Article
ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER
YEZDI DORDI, ALBINA ZIELIENE, LORETA TAMASAUSKAITE-TAMASIUNAITE, ALDONA JAGMINIENE, ANIRUDDHA JOI, EUGENIJUS NORKUS, INA STANKEVICIENE
Year of Publication 24.08.2015
Get full text
Year of Publication 24.08.2015
Patent
Study of adhesion for Cu/Ru(Zn) on dielectrics by an improved four-point bending measurement
Peng, Wang, Qu, Xin-Ping, Dordi, Yezdi
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
Get full text
Conference Proceeding