Phase Equilibria of the Ag-Al-Au Ternary System and Interfacial Reactions in the Au-xAg/Al Couples at 450 °C
Ramadhani, Mavindra, Laksono, Andromeda Dwi, Liang, Chien-Lung, Yang, Chiao-Yi, Chen, Kuo-Jung, Yen, Yee-Wen, Hsiao, Hsien-Ming
Published in Materials (01.11.2023)
Published in Materials (01.11.2023)
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Journal Article
Phase equilibria of the Cu-Zr-Ti ternary system at 703 °C and the thermodynamic assessment and metallic glass region prediction of the Cu-Zr-Ti ternary system
Hermana, Gita Novian, Hsiao, Hsien-Ming, Kuo, Po-Cheng, Liaw, Peter K., Li, Yu-Chun, Iikubo, Satoshi, Yen, Yee-Wen
Published in Journal of non-crystalline solids (01.01.2021)
Published in Journal of non-crystalline solids (01.01.2021)
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Journal Article
The Effect of Increasing Nickel Content on the Microstructure, Hardness, and Corrosion Resistance of the CuFeTiZrNix High-Entropy Alloys
Kuo, Po-Cheng, Chen, Sin-Yi, Yu, William, Okumura, Ryo, Iikubo, Satoshi, Laksono, Andromeda Dwi, Yen, Yee-Wen, Pasana, Alberto S.
Published in Materials (25.04.2022)
Published in Materials (25.04.2022)
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Journal Article
Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples
Li, Yu-Chun, Chang, Ching-Hsun, Pasana, Alberto S., Hsiao, Hsien-Ming, Yen, Yee-Wen
Published in Journal of electronic materials (01.03.2021)
Published in Journal of electronic materials (01.03.2021)
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Journal Article
Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder
Chiang, Tzu-Yang, Chang, Yong-Chi, Wang, Chao-Hong, Laksono, Andromeda Dwi, Yen, Yee-Wen
Published in Metals (Basel ) (01.04.2023)
Published in Metals (Basel ) (01.04.2023)
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Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates
Laksono, Andromeda Dwi, Tsai, Tzu-Yang, Chung, Tai-Hsuan, Chang, Yong-Chi, Yen, Yee-Wen
Published in Metals (Basel ) (01.01.2023)
Published in Metals (Basel ) (01.01.2023)
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Preparation of ZnO/NiO-loaded flexible cellulose nanofiber film electrodes and their application to dye-sensitized solar cells
Gemeda, Getachew Feyissa, Etefa, Habtamu Fekadu, Hsieh, Chin-Chih, Kebede, Mekuriaw Assefa, Imae, Toyoko, Yen, Yee-Wen
Published in Carbohydrate polymer technologies and applications (01.06.2022)
Published in Carbohydrate polymer technologies and applications (01.06.2022)
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Journal Article
Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate
Liu, Chia-Yu, Kuo, Po-Cheng, Chen, Chih-Ming, Dai, Jia-Ying, Yen, Yee-Wen, Pasana, Alberto S.
Published in Journal of electronic materials (2020)
Published in Journal of electronic materials (2020)
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Journal Article
Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys
Yen, Yee-Wen, Yu, William, Wang, Chu-Hsuan, Chen, Chih-Ming, Li, Yu-Chun, Chen, Pei-Yu, Chen, Guan-Da
Published in Journal of electronic materials (01.01.2019)
Published in Journal of electronic materials (01.01.2019)
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Journal Article
Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor–liquid crystal display applications
Yen, Yee-Wen, Kuo, Yu-Lin, Chen, Jian-Yu, Lee, Chiapyng, Lee, Chung-Yu
Published in Thin solid films (25.06.2007)
Published in Thin solid films (25.06.2007)
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Femtosecond pulse laser fabrication of zinc oxide quantum clusters/nanoparticles and their electrical, optical, and chemical characteristics
Feyissa Gemeda, Getachew, Hwang, Woei-Jyh, Imae, Toyoko, Yen, Yee-Wen
Published in Journal of colloid and interface science (15.05.2022)
Published in Journal of colloid and interface science (15.05.2022)
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Journal Article
Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders
Yen, Yee-Wen, Chou, Weng-Ting, Tseng, Yu, Lee, Chiapyng, Hsu, Chun-Lei
Published in Journal of electronic materials (01.01.2008)
Published in Journal of electronic materials (01.01.2008)
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Journal Article
Conference Proceeding
The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates
Lin, Chung-Yung, Jao, Chien-Chung, Lee, Chiapyng, Yen, Yee-Wen
Published in Journal of alloys and compounds (16.08.2007)
Published in Journal of alloys and compounds (16.08.2007)
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Journal Article
Interfacial Reactions Between Sn-Zn Alloys and Au Substrate
Yen, Yee-wen, Lin, Ming-chih, Lin, Cheng-kuan, Chen, Wan-ching
Published in Journal of electronic materials (01.12.2012)
Published in Journal of electronic materials (01.12.2012)
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