Advanced thin copper electroplating process for HDI microvia filling application
Ming-Yao Yen, Ming-Hung Chiang, Hsu-Hsin Tai, Hsien-Chang Chen, Kwok-Wai Yee, Li, Crystal, Najjar, Elie, Lefebvre, Mark, Xie, Betty
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding
Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
Ming-Yao Yen, Ming-Hung Chiang, Hsu-Hsin Tai, Hsien-Chang Chen, Kwok-Wai Yee, Li, C., Lefebvre, M., Bayes, M.
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
금 도금 용액
YEE KWOK WAI DENNIS, TONG KITHO, CHEN CHEN, CHAN CHIT YIU, DUAN LINGLI
Year of Publication 16.05.2018
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Year of Publication 16.05.2018
Patent
A potential silver catalyst system for new generation of electroless Cu process as a palladium substitution
Lok Lok Liu, Sau Man Ku, Chit Yiu Chan, Kwok Wai Yee
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
A new MHC catalyst system - Nano-Silver
Wenjia Zhou, Suk-Kwan Kwong, Chit-Yiu Chan, Kwok-Wai Yee
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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Conference Proceeding
Palladium deactivation pretreatment process for electroless nickel immersion gold process (ENIG): Elimination of metal plating at non-plated through holes (NPTH)
Lok Lok Liu, Chun Man Chan, Chit Yiu Chan, Kwok Wai Yee
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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Conference Proceeding
Electroplating apparatus and method considerations for high aspect-ratio through-hole copper electroplating process
Ming-Yao Yen, Yuk-Nam Hung, Kwok-Wai Yee, Hsien-Chang Chen, Hsin-Sen Liang, Lefebvre, Mark
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
Evaluation of the Psychometric Properties of the Asian Adolescent Depression Scale and Construction of a Short Form: An Item Response Theory Analysis
Lo, Barbara Chuen Yee, Zhao, Yue, Kwok, Alice Wai Yee, Chan, Wai, Chan, Calais Kin Yuen
Published in Assessment (Odessa, Fla.) (01.07.2017)
Published in Assessment (Odessa, Fla.) (01.07.2017)
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Journal Article
GOLD PLATING SOLUTION
CHEN, Chen, TONG, Kitho, DUAN, Lingli, YEE, Kwok Wai Dennis, CHAN, Chit Yiu
Year of Publication 18.09.2019
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Year of Publication 18.09.2019
Patent
Thermal relay verification method and device, computer equipment and readable storage medium
ZHANG CHENG, GUO HUI, YANG CHENG, LIU GANG, ZOU JIEBIN, YEE KWOK WAI, REN LINBAO
Year of Publication 19.12.2023
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Year of Publication 19.12.2023
Patent