SoIC_H Technology for Heterogeneous System Integration
Yu, Douglas C. H., Wang, Chuei-Tang, Lin, Chia-Chia, Lu, Chih-Hsin, Wu, Gene, Huang, Chien-Yuan, Chen, Wei-Ting, Ku, Terry, Yee, Kuo-Chung, Tsai, Chung-Hao
Published in IEEE transactions on electron devices (01.12.2022)
Published in IEEE transactions on electron devices (01.12.2022)
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Journal Article
A Thermally Friendly Bonding Scheme for 3D System Integration
Kuo, Gordon, Chen, Chih-Yuan, Hsieh, Cheng-Chieh, Lee, Chung-Ju, Wu, Jason, Cui, Ji James, Kuo, Yen-Liang, Tung, Chih-Hang, Ku, Terry, Tsai, Chung-Hao, Yee, Kuo-Chung, Yu, Douglas C.H.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDL
Che-Wei Hsu, Chung-Hao Tsai, Jeng-Shien Hsieh, Kuo-Chung Yee, Chuei-Tang Wang, Yu, Douglas
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology
Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Liang-Ju Yen, Jeng-Nan Hung, Tai-Hao Peng, Hsi-Ching Wang, Cheng-Yu Kuo, Huang, Issac, Welling Chu, Yi-Yang Lei, Yu, C. H., Sheu, Lawrence C., Ching-Hua Hsieh, Liu, C. S., Kuo-Chung Yee, Chuei-Tang Wang, Doug Yu
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
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Conference Proceeding
Journal Article
An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications
Lien, Yu-Jen, Hsieh, Cheng-Chieh, Ku, Terry, Wang, Li, Chen, Po-Ju, Yee, Kuo-Chung, Douglas Yu, C. H.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Moving Towards Microchannel-based Chip Cooling
Semenza, Paul, Thomas, Dave, Oakes, Garrett, Kirsch, Dave, Hang, Yin, Yee, Kuo-Chung, Cumbie, Michael, Benning, Paul, Iyengar, Madhusudan, Cao, Lihong, Chen, William, Samadi, Gity
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
A Study of Low Temperature SoIC Targeting 200 nm Bond Pitch
Wang, Wei-Ming, Yeh, C.W., Chia, Han-Jong, Tsui, R.F., Cui, Ji James, Tung, Chih-Hang, Yee, Kuo-Chung, Yu, Douglas C.H.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
High Bandwidth and Energy Efficient Electrical-Optical System Integration Using COUPE Technology
Lu, Chih-Hsin, Lin, Chia-Chia, Tang, Tzu-Chun, Lin, Chung-Yi, Chang, Jay, Tsai, Chung-Hao, Hsia, Harry, Twu, J. C., Liu, C. S., Wu, Gene, Yee, Kuo-Chung, Yu, Douglas C.H.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Advanced 3D Wafer Level System Integration Technology
Yee, Kuo-Chung, Yu, Doug C.H.
Published in 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (01.08.2020)
Published in 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (01.08.2020)
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Conference Proceeding
Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bond Pitch
Chia, Han-Jong, Tai, Shih-Peng, Cui, Ji James, Wang, Chuei-Tang, Tung, Chih-Hang, Yee, Kuo-Chung, Yu, Douglas C.H.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
3D-MiM (MUST-in-MUST) Technology for Advanced System Integration
Su, An-Jhih, Ku, Terry, Tsai, Chung-Hao, Yee, Kuo-Chung, Yu, Douglas
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding