Meeting the assembly challenges in new semiconductor packaging trend
Lim Lay Yeap
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Feasibility study on replacing conventional epoxy dispensing with wafer back coating epoxy for QFN packages for discrete product
Chong, David, Lay Yeap Lim
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding
Kirkendall Voids Improvement in Thin Small No Lead Package
Lim, Lay Yeap, Huang, Yao Huang
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding