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Published in IEEE electron device letters (01.05.2013)
Published in IEEE electron device letters (01.05.2013)
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Enhancement of pattern quality in maskless plasmonic lithography via spatial loss modulation
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Published in Microsystems & nanoengineering (30.03.2023)
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Published in Journal of materials science. Materials in electronics (01.10.2021)
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Improved Short Channel Effect Control in Bulk FinFETs With Vertical Implantation to Form Self-Aligned Halo and Punch-Through Stop Pocket
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Published in IEEE electron device letters (01.07.2015)
Published in IEEE electron device letters (01.07.2015)
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Impact of Ge Preamorphization Implantation on Both the Formation of Ultrathin TiSix and the Specific Contact Resistivity in TiSix/n-Si Contacts
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Published in IEEE transactions on electron devices (01.10.2018)
Published in IEEE transactions on electron devices (01.10.2018)
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Impact of the Effective Work Function Gate Metal on the Low-Frequency Noise of Gate-All-Around Silicon-on-Insulator NWFETs
Wen Fang, Veloso, Anabela, Simoen, Eddy, Moon-Ju Cho, Collaert, Nadine, Thean, Aaron, Jun Luo, Chao Zhao, Tianchun Ye, Claeys, Cor
Published in IEEE electron device letters (01.04.2016)
Published in IEEE electron device letters (01.04.2016)
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Monolithic Integration of O-Band InAs Quantum Dot Lasers with Engineered GaAs Virtual Substrate Based on Silicon
Xu, Buqing, Wang, Guilei, Du, Yong, Miao, Yuanhao, Li, Ben, Zhao, Xuewei, Lin, Hongxiao, Yu, Jiahan, Su, Jiale, Dong, Yan, Ye, Tianchun, Radamson, Henry H
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Published in Nanomaterials (Basel, Switzerland) (05.08.2022)
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Growth of SiGe layers in source and drain regions for 10 nm node complementary metal-oxide semiconductor (CMOS)
Wang, Guilei, Kolahdouz, M., Luo, Jun, Qin, Changliang, Gu, Shihai, Kong, Zhenzhen, Yin, Xiaogen, Xiong, Wenjuan, Zhao, Xuewei, Liu, Jinbiao, Yang, Tao, Li, Junfeng, Yin, Huaxiang, Zhu, Huilong, Wang, Wenwu, Zhao, Chao, Ye, Tianchun, Radamson, Henry H.
Published in Journal of materials science. Materials in electronics (2020)
Published in Journal of materials science. Materials in electronics (2020)
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Experimental investigation of fundamental film properties for Co1−xTix alloying films with different compositions (0 ≤ x≤1)
Zhang, Dan, Zhao, Chao, Luo, Jun, Mao, Shujuan, Wang, Guilei, Xu, Jing, Luo, Xue, Li, Junfeng, Li, Yongliang, Wang, Wenwu, Chen, Dapeng, Ye, Tianchun
Published in Journal of materials science. Materials in electronics (2020)
Published in Journal of materials science. Materials in electronics (2020)
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Reduction of NiGe/n- and p-Ge Specific Contact Resistivity by Enhanced Dopant Segregation in the Presence of Carbon During Nickel Germanidation
Ningyuan Duan, Jun Luo, Guilei Wang, Jinbiao Liu, Simoen, Eddy, Shujuan Mao, Radamson, Henry, Xiaolei Wang, Junfeng Li, Wenwu Wang, Chao Zhao, Tianchun Ye
Published in IEEE transactions on electron devices (01.11.2016)
Published in IEEE transactions on electron devices (01.11.2016)
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Investigation on Dynamic Characteristics of AlGaN/GaN Lateral Schottky Barrier Diode
Zhang, Haitao, Kang, Xuanwu, Zheng, Yingkui, Wu, Hao, Wei, Ke, Liu, Xinyu, Ye, Tianchun, Jin, Zhi
Published in Micromachines (Basel) (22.10.2021)
Published in Micromachines (Basel) (22.10.2021)
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Investigation on Capacitance Collapse Induced by Secondary Capture of Acceptor Traps in AlGaN/GaN Lateral Schottky Barrier Diode
Zhang, Haitao, Kang, Xuanwu, Zheng, Yingkui, Wei, Ke, Wu, Hao, Liu, Xinyu, Ye, Tianchun, Jin, Zhi
Published in Micromachines (Basel) (09.05.2022)
Published in Micromachines (Basel) (09.05.2022)
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Physically Based Evaluation of Effect of Buried Oxide on Surface Roughness Scattering Limited Hole Mobility in Ultrathin GeOI MOSFETs
Xiaolei Wang, Jinjuan Xiang, Kai Han, Shengkai Wang, Jun Luo, Chao Zhao, Tianchun Ye, Radamson, Henry H., Simoen, Eddy, Wenwu Wang
Published in IEEE transactions on electron devices (01.06.2017)
Published in IEEE transactions on electron devices (01.06.2017)
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Blended Glial Cell's Spiking Neural Network
Tao, Liying, Li, Pan, Meng, Meihua, Yang, Zonglin, Liu, Xiaozhuang, Hu, Jinhua, Dong, Ji, Qiao, Shushan, Ye, Tianchun, Shang, Delong
Published in IEEE access (2023)
Published in IEEE access (2023)
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