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Published in 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2018)
Published in 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2018)
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Electronic device having heat collection/diffusion structure
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Electronic device having heat collection/diffusion structure
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Electronic device having heat collection/diffusion structure
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ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE
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Year of Publication 19.02.2024
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ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE
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Year of Publication 30.08.2023
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ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE
JANG, Se-Young, YE, Jaeheung, KOO, Kyungha, BANG, Jungje, JUNG, Chunghyo, CHO, Chi-Hyun, LEE, Haejin
Year of Publication 30.08.2023
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Year of Publication 30.08.2023
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ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE
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Year of Publication 04.11.2021
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ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE
JANG, Se-Young, YE, Jaeheung, KOO, Kyungha, BANG, Jungje, JUNG, Chunghyo, CHO, Chi-Hyun, LEE, Haejin
Year of Publication 04.08.2021
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Year of Publication 04.08.2021
Patent
ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE
JANG, Se-Young, YE, Jaeheung, KOO, Kyungha, BANG, Jungje, JUNG, Chunghyo, CHO, Chi-Hyun, LEE, Haejin
Year of Publication 25.02.2021
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Year of Publication 25.02.2021
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