Crosstalk study of high speed on-package interconnects for multi-chip package
Bok Eng Cheah, Kong, Jackson, Khang Choong Yong, Lo, Louis, Po Yin Yaw
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
Capacitive crosstalk compensation structure for improved high-speed on-package signaling
Bok Eng Cheah, Kong, Jackson, Ping Ping Ooi, Kok Hou Teh, Po Yin Yaw
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Semiconductor package having an impedance-boosting channel
Yaw, Po Yin, Cheah, Bok Eng, Kong, Jackson Chung Peng, Yong, Khang Choong, Teh, Kok Hou
Year of Publication 06.04.2021
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Year of Publication 06.04.2021
Patent
SEMICONDUCTOR PACKAGE HAVING AN IMPEDANCE-BOOSTING CHANNEL
YONG, Khang Choong, CHEAH, Bok Eng, TEH, Kok Hou, KONG, Jackson Chung Peng, YAW, Po Yin
Year of Publication 13.06.2019
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Year of Publication 13.06.2019
Patent
SEMICONDUCTOR PACKAGE HAVING AN IMPEDANCE-BOOSTING CHANNEL
YONG, Khang Choong, CHEAH, Bok Eng, TEH, Kok Hou, KONG, Jackson Chung Peng, YAW, Po Yin
Year of Publication 05.04.2018
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Year of Publication 05.04.2018
Patent