Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects
Yarmchuk, E J, Cline, C W, Bruen, D C
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Journal Article
Flip chip ball grid array with low impedence and grounded lid
Dallaire, Yves, Gaynes, Michael, Beaumier, Martin, Yarmchuk, Edward J, Doll, Melania C
Year of Publication 27.11.2018
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Year of Publication 27.11.2018
Patent
Flip chip ball grid array with low impedence and grounded lid
Dallaire, Yves, Gaynes, Michael, Beaumier, Martin, Yarmchuk, Edward J, Doll, Melania C
Year of Publication 07.08.2018
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Year of Publication 07.08.2018
Patent
A self-servowrite clocking process
Schultz, M.D., Yarmchuk, E.J., Webb, B.C., Chainer, T.J.
Published in IEEE transactions on magnetics (01.07.2001)
Published in IEEE transactions on magnetics (01.07.2001)
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Journal Article
Conference Proceeding
FLIP CHIP BALL GRID ARRAY WITH LOW IMPEDNCE AND GROUNDED LID
Beaumier Martin, Doll Melania C, Yarmchuk Edward J, Dallaire Yves, Gaynes Michael
Year of Publication 29.03.2018
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Year of Publication 29.03.2018
Patent
FLIP CHIP BALL GRID ARRAY WITH LOW IMPEDNCE AND GROUNDED LID
Beaumier Martin, Doll Melania C, Yarmchuk Edward J, Dallaire Yves, Gaynes Michael
Year of Publication 29.03.2018
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Year of Publication 29.03.2018
Patent
Flip chip ball grid array with low impedance and grounded lid
Beaumier Martin, Doll Melania C, Yarmchuk Edward J, Michael Gaynes Michael, Dallaire Yves
Year of Publication 10.10.2017
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Year of Publication 10.10.2017
Patent