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"YAP WENG F"
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"YAP WENG F"
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System-in-packages containing preassembled surface mount device modules and methods for the production thereof
by
Yap Weng F
Year of Publication
03.10.2017
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Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
by
Yap Weng F
Year of Publication
12.09.2017
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SYSTEM-IN-PACKAGES CONTAINING PREASSEMBLED SURFACE MOUNT DEVICE MODULES AND METHODS FOR THE PRODUCTION THEREOF
by
YAP WENG F
Year of Publication
16.03.2017
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Stacked microelectronic package assemblies and methods for the fabrication thereof
by
Yap Weng F
Year of Publication
14.03.2017
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STACKED MICROELECTRONIC PACKAGE ASSEMBLIES AND METHODS FOR THE FABRICATION THEREOF
by
YAP WENG F
Year of Publication
09.03.2017
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Integrated electronic package and method of fabrication
by
Yap Weng F
Year of Publication
18.10.2016
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LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE MOUNT DEVICES AND METHODS FOR THE PRODUCTION THEREOF
by
YAP WENG F
Year of Publication
21.04.2016
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Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
by
YAP WENG F
Year of Publication
09.02.2016
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INTEGRATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
by
YAP WENG F
Year of Publication
10.12.2015
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LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE MOUNT DEVICES AND METHODS FOR THE PRODUCTION THEREOF
by
YAP WENG F
Year of Publication
17.09.2015
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Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof
by
Yap Weng F
,
Gong Zhiwei
Year of Publication
28.03.2017
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Microelectronic packages containing opposing devices and methods for the fabrication thereof
by
YAP WENG F
Year of Publication
05.05.2015
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MICROELECTRONIC PACKAGES CONTAINING OPPOSING DEVICES AND METHODS FOR THE FABRICATION THEREOF
by
YAP WENG F
Year of Publication
05.03.2015
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Packaged semiconductor device
by
YAP WENG F
Year of Publication
24.02.2015
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PACKAGED SEMICONDUCTOR DEVICE
by
YAP WENG F
Year of Publication
28.08.2014
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FAN-OUT WAFER LEVEL PACKAGES CONTAINING EMBEDDED GROUND PLANE INTERCONNECT STRUCTURES AND METHODS FOR THE FABRICATION THEREOF
by
GONG ZHIWEI
,
YAP WENG F
Year of Publication
28.04.2016
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System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereof
by
GONG ZHIWEI
,
YAP WENG F
Year of Publication
08.03.2016
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Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof
by
GONG ZHIWEI
,
YAP WENG F
Year of Publication
09.02.2016
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SYSTEM-IN-PACKAGES HAVING VERTICALLY-INTERCONNECTED LEADED COMPONENTS AND METHODS FOR THE FABRICATION THEREOF
by
GONG ZHIWEI
,
YAP WENG F
Year of Publication
24.12.2015
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Integrated electronic package and stacked assembly thereof
by
Yap Weng F
,
Vincent Michael B
Year of Publication
04.07.2017
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basic electric elements
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