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"YAP, WENG FOONG"
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"YAP, WENG FOONG"
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Packaged pressure sensor device
by
Shantaram, Sandeep
,
Yap
,
Weng Foong
,
Tang, Jinbang
Year of Publication
30.08.2022
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INTEGRATED CIRCUIT PACKAGE WITH SOLDER BALLS ON TWO SIDES
by
Yap Weng Foong
Year of Publication
30.11.2017
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Semiconductor device package and methods of manufacture thereof
by
Yap Weng Foong
Year of Publication
10.10.2017
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Antenna assembly for wafer level packaging
by
Yap
,
Weng Foong
,
Tang, Jinbang
Year of Publication
11.06.2019
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PACKAGED PRESSURE SENSOR DEVICE
by
Shantaram, Sandeep
,
Yap
,
Weng Foong
,
Tang, Jinbang
Year of Publication
14.01.2021
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Packaged pressure sensor device
by
Shantaram, Sandeep
,
Yap
,
Weng Foong
,
Tang, Jinbang
Year of Publication
03.11.2020
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PACKAGED PRESSURE SENSOR DEVICE
by
Shantaram, Sandeep
,
YAP
,
Weng Foong
,
Tang, Jinbang
Year of Publication
18.04.2019
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ANTENNA ASSEMBLY FOR WAFER LEVEL PACKAGING
by
Tang Jinbang
,
Yap Weng Foong
Year of Publication
01.06.2017
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SYSTEM-IN-PACKAGES CONTAINING EMBEDDED SURFACE MOUNT DEVICES AND METHODS FOR THE FABRICATION THEREOF
by
YAP WENG FOONG
Year of Publication
19.03.2015
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Semiconductor package signal routing using conductive vias
by
YAP WENG FOONG
Year of Publication
06.01.2015
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SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS
by
YAP WENG FOONG
Year of Publication
19.06.2014
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METHODS AND APPARATUS FOR DISSIPATING HEAT FROM A DIE ASSEMBLY
by
TANG JINBANG
,
YAP WENG FOONG
Year of Publication
02.07.2015
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Method of forming a high thermal conducting semiconductor device package
by
TANG JINBANG
,
YAP WENG FOONG
Year of Publication
12.05.2015
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METHOD OF FORMING A HIGH THERMAL CONDUCTING SEMICONDUCTOR DEVICE PACKAGE
by
TANG JINBANG
,
YAP WENG FOONG
Year of Publication
04.12.2014
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Semiconductor device package and methods of manufacture thereof
by
YAP WENG FOONG
Year of Publication
08.12.2017
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Semiconductor grid array package
by
LIM FUI YEE
,
YAP WENG FOONG
Year of Publication
08.12.2015
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Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof
by
MITCHELL DOUGLAS G
,
YAP WENG FOONG
Year of Publication
01.09.2015
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Microelectronic packages and methods for the fabrication thereof
by
MITCHELL DOUGLAS G
,
YAP WENG FOONG
Year of Publication
28.04.2015
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MICROELECTRONIC PACKAGES HAVING FRONTSIDE THERMAL CONTACTS AND METHODS FOR THE FABRICATION THEREOF
by
MITCHELL DOUGLAS G
,
YAP WENG FOONG
Year of Publication
15.01.2015
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MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRICATION THEREOF
by
MITCHELL DOUGLAS G
,
YAP WENG FOONG
Year of Publication
15.01.2015
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