Higher efficiency Power Module solutions by chip embedding
Essig, Kay S., Chiu, C. T., Kuo, Jarris, Chen, Phidia, Yannou, Jean-Marc
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
High efficient mid power modules by next generation chip embedding technology
Essig, Kay S, Yannou, Jean-Marc, Chiu, C T, Kuo, Jarris, Chen, Phidia
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
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Conference Proceeding
High efficiency power solutions by chip embedding
Essig, Kay S., Chiu, Ct, Kuo, Jarris, Chen, Phidia, Yannou, Jean-Marc
Published in 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) (01.06.2016)
Published in 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) (01.06.2016)
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Conference Proceeding
SiP and WLP-CSP Trends: State-of-the-art and future trends
Yannou, J.-M.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Computational Approach for Reliable and Robust System-in-Package Design
Stoyanov, S., Bailey, C., Strusevich, N., Yannou, J.-M.
Published in 2007 30th International Spring Seminar on Electronics Technology (ISSE) (01.05.2007)
Published in 2007 30th International Spring Seminar on Electronics Technology (ISSE) (01.05.2007)
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Conference Proceeding
Design for Reliability for Wafer Level System in Package
Stoyanov, S., Strusevich, N., Rizvi, J., Georgel, V., Yannou, J.-M., Bailey, C.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Copper pillar shape and related stress simulation studies in flip chip packages
Ying-Chih Lee, Factor, Bradford, Chin-Li Kao, Yannou, Jean-Marc, Chang-Chi Lee
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding
Packaged semiconductor product and method for manufacture thereof
YANNOU JEAN-MARC, BELLENGER STEPHANE, POMMIER MICKAEL, PIERAERTS ERIC
Year of Publication 24.02.2015
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Year of Publication 24.02.2015
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