Research on Packaging Reliability of LTCC High Density Packaging Substrate with High-CTE
Li, Han, Zhang, Xiaojun, Yang, Zhentao, Liu, Linjie
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Get full text
Conference Proceeding