Signal transmission analysis of SATA cable assembly
Moonjung Kim, Jeong-Kyu Yang
Published in 2014 International Conference on Electronics, Information and Communications (ICEIC) (01.01.2014)
Published in 2014 International Conference on Electronics, Information and Communications (ICEIC) (01.01.2014)
Get full text
Conference Proceeding
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
LEE, YUNG WOO, KIM, BYONG JIN, BANG, DONG HYUN, YANG, JEONG KYU, JUNG, KYU ICK, LEE, JAE UNG, CHO, EUNRA, KIM, YOUNG SEOK, SHIN, DOO SOUB
Year of Publication 02.08.2018
Get full text
Year of Publication 02.08.2018
Patent
A Eco-friendly System for Culturing Plant
HYUN, MYUNG TEK, YANG, JEONG KYU, KIM, YONG HWAN, KIM, DAE YOUNG, OH, GWAN JUN
Year of Publication 30.11.2016
Get full text
Year of Publication 30.11.2016
Patent
GAS DETECTION SENSOR USING COMPLEX PEROVSKITE OXIDE AND ITS FABRICATION METHOD
YANG, JEONG KYU, PARK, SU YEON, KIM, NAM KYU, KWON, HEE SEOK, KIM, JUNG HYUN, HONG, SEUNG PYO, SUN, SU IN, KIM, CHAE YEOL, KIM, WOO JIN
Year of Publication 21.08.2018
Get full text
Year of Publication 21.08.2018
Patent
SYSTEM FOR AUTHENTICATION OF SMARTCARD READING SYSTEM AND METHOD THEREFOR
YANG, JEONG KYU, KIM, KI DONG, SONG, HO GUN, LEE, WAN SEOP, LEE, HO SANG
Year of Publication 17.06.2014
Get full text
Year of Publication 17.06.2014
Patent
A CAPACITIVE TOUCH PEN
PARK, KUN HYUN, KANG, CHUL UNG, YANG, JEONG KYU, KANG, HYUN JIN, KANG, JU HAN
Year of Publication 06.10.2011
Get full text
Year of Publication 06.10.2011
Patent
New Robo-cylinder Impactor System for the Spinal Cord Injury Model
Jeong-Kyu Yang, Chul Ung Kang, Jong Hwan Lim, Tae Kyun Shin, Ki-Bum Sim
Published in 2012 IEEE/ACIS 11th International Conference on Computer and Information Science (01.05.2012)
Published in 2012 IEEE/ACIS 11th International Conference on Computer and Information Science (01.05.2012)
Get full text
Conference Proceeding
Removal of heavy metals using waste eggshell
PARK, Heung Jai, JEONG, Seong Wook, YANG, Jae Kyu, KIM, Boo Gil, LEE, Seung Mok
Published in Journal of environmental sciences (China) (2007)
Published in Journal of environmental sciences (China) (2007)
Get full text
Journal Article
High-speed flip chip package Co-Design with Optimization of anti-pad size variations on metal plane layout
HoJeong Lim, JeongKyu Yang, HeeYeon Ku, ChongGeun Ahn, TaeYong Lee, ByongJin Kim, JiYong Chung
Published in 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) (01.05.2016)
Published in 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) (01.05.2016)
Get full text
Conference Proceeding