Metal interconnect structure for a microelectronic element
YANG CHIH CHAO, CLEVENGER LAWRENCE, YANG DAE WON, WANG YUN YU, CHANDA KAUSHIK
Year of Publication 20.01.2010
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Year of Publication 20.01.2010
Patent
Metal interconnect structure for a microelectronic element
YANG CHIH CHAO, CLEVENGER LAWRENCE, YANG DAE WON, WANG YUN YU, CHANDA KAUSHIK
Year of Publication 17.09.2008
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Year of Publication 17.09.2008
Patent
Method and structure of forming an interconnect including a dielectric cap having a tensile stress
CHANDA, KAUSHIK, YANG, CHIHAO, WANG, YUN-YU, CLEVENGER, LAWRENCE A, YANG, DAE-WON
Year of Publication 01.08.2007
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Year of Publication 01.08.2007
Patent