Evaluation of back end of line structures underneath wirebond pads in ultra low-k device
Aoki, T., Hisada, T., Okamoto, K., Malinowski, J. C., Beckham, K. F., Yong-Seok Yang, Joon-Su Kim, Harada, S.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Get full text
Conference Proceeding
All purpose spanner
LEE JUNG WOO, YOO SUN WOONG, YANG YONG SEOK, YOO JIN HA, KIM DAE KYU, HAM SEUNG KYUN, KIM DUCK HO, CHOI YO HAN, LEE SE MIN
Year of Publication 02.08.2019
Get full text
Year of Publication 02.08.2019
Patent