Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application
Wang, Zhao-Yun, Yu, Daquan, Jin, Lei, Yang, Jia-Qiang, Zhan, DongPing, Yang, Fang-Zu, Sun, Shi-Gang
Published in Journal of manufacturing processes (15.07.2024)
Published in Journal of manufacturing processes (15.07.2024)
Get full text
Journal Article
Rational fabrication of silver-coated AFM TERS tips with a high enhancement and long lifetime
Huang, Teng-Xiang, Li, Cha-Wei, Yang, Li-Kun, Zhu, Jin-Feng, Yao, Xu, Liu, Chuan, Lin, Kai-Qiang, Zeng, Zhi-Cong, Wu, Si-Si, Wang, Xiang, Yang, Fang-Zu, Ren, Bin
Published in Nanoscale (2018)
Published in Nanoscale (2018)
Get full text
Journal Article
Rational fabrication of a gold-coated AFM TERS tip by pulsed electrodeposition
Yang, Li-Kun, Huang, Teng-Xiang, Zeng, Zhi-Cong, Li, Mao-Hua, Wang, Xiang, Yang, Fang-Zu, Ren, Bin
Published in Nanoscale (21.11.2015)
Published in Nanoscale (21.11.2015)
Get full text
Journal Article
1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating
Jin, Lei, Wang, Zhao-Yun, Cai, Zhuan-Yun, Yang, Jia-Qiang, Zheng, An-Ni, Yang, Fang-Zu, Wu, De-Yin, Zhan, Dongping
Published in Journal of industrial and engineering chemistry (Seoul, Korea) (25.09.2023)
Published in Journal of industrial and engineering chemistry (Seoul, Korea) (25.09.2023)
Get full text
Journal Article
Illuminating nanostructured gold electrode: surface plasmons or electron ejection?
Huang, Di, He, Quanfeng, Shan, Jie-Jie, Sartin, Matthew, Pang, Ran, Yang, Fang-Zu, Zhou, Yongliang, Ren, Bin, Tian, Zhong-Qun, Zhan, Dongping
Published in Faraday discussions (01.10.2018)
Published in Faraday discussions (01.10.2018)
Get full text
Journal Article
Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents
Li, Wei‐Qing, Jin, Lei, Yang, Jia‐Qiang, Wang, Zhao‐Yun, Zhan, Dongping, Yang, Fang‐Zu, Tian, Zhong‐Qun
Published in ChemElectroChem (14.06.2022)
Published in ChemElectroChem (14.06.2022)
Get full text
Journal Article
Competing Mechanisms in the Acetaldehyde Functionalization of Positively Charged Hydrogenated Silicene
Yang, Li‐Kun, Zhang, Xia‐Guang, Yang, Fang‐Zu, Wu, De‐Yin, Liu, Xiang‐Yang, Tian, Zhong‐Qun
Published in Chemphyschem (02.02.2017)
Published in Chemphyschem (02.02.2017)
Get full text
Journal Article
Electropolishing of titanium alloy under hydrodynamic mode
Huang, Pei, Lai, Junhui, Han, Lianhuan, Yang, Fang-Zu, Jiang, Li-Min, Su, Jian-Jia, Tian, Zhao-Wu, Tian, Zhong-Qun, Zhan, Dongping
Published in Science China. Chemistry (01.11.2016)
Published in Science China. Chemistry (01.11.2016)
Get full text
Journal Article
Electrochemically Assisted Fabrication of Metal Atomic Wires and Molecular Junctions by MCBJ and STM-BJ Methods
Tian, Jing-Hua, Yang, Yang, Zhou, Xiao-Shun, Schöllhorn, Bernd, Maisonhaute, Emmanuel, Chen, Zhao-Bin, Yang, Fang-Zu, Chen, Yong, Amatore, Christian, Mao, Bing-Wei, Tian, Zhong-Qun
Published in Chemphyschem (10.09.2010)
Published in Chemphyschem (10.09.2010)
Get full text
Journal Article
Conductance histogram evolution of an EC–MCBJ fabricated Au atomic point contact
Yang, Yang, Liu, Jun-Yang, Chen, Zhao-Bin, Tian, Jing-Hua, Jin, Xi, Liu, Bo, Li, Xiulan, Luo, Zhong-Zi, Lu, Miao, Yang, Fang-Zu, Tao, Nongjian, Tian, Zhong-Qun
Published in Nanotechnology (08.07.2011)
Published in Nanotechnology (08.07.2011)
Get full text
Journal Article
Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating
Song, Tao, Wang, Zhao-Yun, Yang, Jia-Qiang, Zhao, Yi, Yang, Fang-Zu, Zhan, Dongping
Published in Journal of electroanalytical chemistry (Lausanne, Switzerland) (01.07.2024)
Published in Journal of electroanalytical chemistry (Lausanne, Switzerland) (01.07.2024)
Get full text
Journal Article
1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia void-free filling and through hole conformal thickening
Zhao, Yi, Wang, Zhao-Yun, Jin, Lei, Yang, Jia-Qiang, Song, Tao, Yang, Fang-Zu, Zhan, Dongping
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (20.08.2024)
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (20.08.2024)
Get full text
Journal Article
Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications
Wang, Zhao-Yun, Jin, Lei, Li, Guang, Yang, Jia-Qiang, Li, Wei-Qing, Zhan, DongPing, Jiang, Yan-Xia, Yang, Fang-Zu, Sun, Shi-Gang
Published in Electrochimica acta (01.04.2022)
Published in Electrochimica acta (01.04.2022)
Get full text
Journal Article
Coordination behavior of theophylline with Au(III) and electrochemical reduction of the complex
Jin, Lei, Liu, Cheng, Yang, Fang-Zu, Wu, De-Yin, Tian, Zhong-Qun
Published in Electrochimica acta (01.05.2019)
Published in Electrochimica acta (01.05.2019)
Get full text
Journal Article
Advanced Ag nanoparticles for the catalyzation of glyoxylic acid oxidation in through-holes electroless copper metallization
Zheng, An-Ni, Wang, Zhao-Yun, Yang, Jia-Qiang, Jin, Lei, Yang, Fang-Zu, Zhan, Dong-Ping
Published in Journal of colloid and interface science (15.10.2023)
Published in Journal of colloid and interface science (15.10.2023)
Get full text
Journal Article
Confined Etchant Layer Technique: An Electrochemical Approach to Micro-/Nanomachining
Han, Lianhuan, Xu, Hantao, Shi, Kang, Zhou, Jian-Zhang, Yang, Fang-Zu, Zhan, Dongping, Tian, Zhong-Qun, Tian, Zhao-Wu
Published in Journal of physical chemistry. C (20.07.2023)
Published in Journal of physical chemistry. C (20.07.2023)
Get full text
Journal Article
A Controllable Electrochemical Fabrication of Metallic Electrodes with a Nanometer/Angstrom-Sized Gap Using an Electric Double Layer as Feedback
Xiang, Juan, Liu, Bo, Wu, Sun-Tao, Ren, Bin, Yang, Fang-Zu, Mao, Bing-Wei, Chow, Yuan L., Tian, Zhong-Qun
Published in Angewandte Chemie (International ed.) (11.02.2005)
Published in Angewandte Chemie (International ed.) (11.02.2005)
Get full text
Journal Article
Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection
Jin, Lei, Zheng, An-Ni, Wang, Mei, Yang, Jia-Qiang, Wang, Zhao-Yun, Yang, Fang-Zu, Wu, De-Yin, Zhan, Dongping
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (20.08.2023)
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (20.08.2023)
Get full text
Journal Article
Phase transformation sequence of amorphous ferrochrome alloy electrodeposit
Liu, Cheng, Jin, Lei, Yang, Fang-Zu, Tian, Zhong-Qun
Published in Journal of alloys and compounds (05.04.2019)
Published in Journal of alloys and compounds (05.04.2019)
Get full text
Journal Article