Increasing the efficiency and precision of prime editing with guide RNA pairs
Zhuang, Yuan, Liu, Jiangle, Wu, Hao, Zhu, Qingguo, Yan, Yongchang, Meng, Haowei, Chen, Peng R, Yi, Chengqi
Published in Nature chemical biology (01.01.2022)
Published in Nature chemical biology (01.01.2022)
Get full text
Journal Article
DNA repair glycosylase hNEIL1 triages damaged bases via competing interaction modes
Liu, Menghao, Zhang, Jun, Zhu, Chenxu, Zhang, Xiaoxue, Xiao, Weide, Yan, Yongchang, Liu, Lulu, Zeng, Hu, Gao, Yi Qin, Yi, Chengqi
Published in Nature communications (05.07.2021)
Published in Nature communications (05.07.2021)
Get full text
Journal Article
Mitochondrial base editor induces substantial nuclear off-target mutations
Lei, Zhixin, Meng, Haowei, Liu, Lulu, Zhao, Huanan, Rao, Xichen, Yan, Yongchang, Wu, Hao, Liu, Min, He, Aibin, Yi, Chengqi
Published in Nature (London) (23.06.2022)
Published in Nature (London) (23.06.2022)
Get full text
Journal Article
Detect-seq reveals out-of-protospacer editing and target-strand editing by cytosine base editors
Lei, Zhixin, Meng, Haowei, Lv, Zhicong, Liu, Menghao, Zhao, Huanan, Wu, Hao, Zhang, Xiaoxue, Liu, Lulu, Zhuang, Yuan, Yin, Kailin, Yan, Yongchang, Yi, Chengqi
Published in Nature methods (01.06.2021)
Published in Nature methods (01.06.2021)
Get full text
Journal Article
Re-engineering the adenine deaminase TadA-8e for efficient and specific CRISPR-based cytosine base editing
Chen, Liang, Zhu, Biyun, Ru, Gaomeng, Meng, Haowei, Yan, Yongchang, Hong, Mengjia, Zhang, Dan, Luan, Changming, Zhang, Shun, Wu, Hao, Gao, Hongyi, Bai, Sijia, Li, Changqing, Ding, Ruoyi, Xue, Niannian, Lei, Zhixin, Chen, Yuting, Guan, Yuting, Siwko, Stefan, Cheng, Yiyun, Song, Gaojie, Wang, Liren, Yi, Chengqi, Liu, Mingyao, Li, Dali
Published in Nature biotechnology (01.05.2023)
Published in Nature biotechnology (01.05.2023)
Get full text
Journal Article
Author Correction: Re-engineering the adenine deaminase TadA-8e for efficient and specific CRISPR-based cytosine base editing
Chen, Liang, Zhu, Biyun, Ru, Gaomeng, Meng, Haowei, Yan, Yongchang, Hong, Mengjia, Zhang, Dan, Luan, Changming, Zhang, Shun, Wu, Hao, Gao, Hongyi, Bai, Sijia, Li, Changqing, Ding, Ruoyi, Xue, Niannian, Lei, Zhixin, Chen, Yuting, Guan, Yuting, Siwko, Stefan, Cheng, Yiyun, Song, Gaojie, Wang, Liren, Yi, Chengqi, Liu, Mingyao, Li, Dali
Published in Nature biotechnology (01.06.2024)
Published in Nature biotechnology (01.06.2024)
Get full text
Journal Article
A damage model for SnAgCu solder under thermal cycling
Hui Xiao, Xiaoyan Li, Na Liu, Yongchang Yan
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Get full text
Conference Proceeding
FEM analysis of SnAgCu solder joint in flip chip
Yongchang Yan, Xiaoyan Li, Na Liu
Published in 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2009)
Published in 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2009)
Get full text
Conference Proceeding
Investigation on fatigue-creep interaction damage model for solder
Na Liu, Xiaoyan Li, Yongchang Yan
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Get full text
Conference Proceeding
Damage Behavior of SnAgCu Solder under Thermal Cycling
Hui, Xiao, Li, Xiaoyan, Yan, Yongchang, Liu, Na, Shi, Yaowu
Published in Rare metal materials and engineering (01.02.2013)
Published in Rare metal materials and engineering (01.02.2013)
Get full text
Journal Article