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Year of Publication 14.06.2023
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ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES
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FLEXIBLE SINTERING TOOL FOR BONDING SEMICONDUCTOR DEVICE
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Year of Publication 16.11.2022
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FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
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Year of Publication 11.11.2022
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DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Year of Publication 04.04.2019
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Encapsulation process for double-sided cooled packages
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Year of Publication 09.04.2024
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Year of Publication 09.04.2024
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ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES
LIN, Yi, YAN, Kar Weng, KUAH, Teng Hock, RAGHAVENDRA, Ravindra, PEREZ, Angelito Barrozo
Year of Publication 08.11.2023
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Year of Publication 08.11.2023
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Flexible sinter tool for bonding semiconductor devices
Ding, Jiapei, Yan, Kar Weng, Liao, Jian, Camba, Rolan Ocuaman, Kuah, Teng Hock
Year of Publication 13.06.2023
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Year of Publication 13.06.2023
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ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES
LIN, Yi, YAN, Kar Weng, KUAH, Teng Hock, RAGHAVENDRA, Ravindra, PEREZ, Angelito Barrozo
Year of Publication 08.06.2023
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Year of Publication 08.06.2023
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ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES
LIN, Yi, YAN, Kar Weng, KUAH, Teng Hock, RAGHAVENDRA, Ravindra, PEREZ, Angelito Barrozo
Year of Publication 07.06.2023
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Year of Publication 07.06.2023
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FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
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Year of Publication 22.03.2023
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Year of Publication 22.03.2023
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FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
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Year of Publication 10.11.2022
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Year of Publication 10.11.2022
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FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
Teng Hock, Kuah, Jian, Liao, Kar Weng, Yan, Rolan Ocuaman, Camba, Jiapei, Ding
Year of Publication 09.11.2022
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Year of Publication 09.11.2022
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APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
YUAN, BIN, KUAH TENG HOCK, SONG KENG YEW, MOULEESWARAN DEIVASIGAMANI, LIAO JIAN, YAN KAR WENG, DING JIAPEI
Year of Publication 27.10.2022
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Year of Publication 27.10.2022
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APPARAT TIL BEARBEJDNING AF EN HALVLEDERINDRETNING
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Year of Publication 04.07.2022
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Year of Publication 04.07.2022
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