Microcatheter-guided compartment packing of acutely ruptured complex intracerebral aneurysms (ARCIAs): Preliminary experience and technical note
Zhang, Yi-Bin, Xie, Bing-Sen, Wang, Hao-Jie, Huang, Sheng-Xuan, Fan, Wen-Jian, Zhu, Mei, Chen, Guo-Rong, Wang, Deng-Liang, Yao, Pei-Sen, Yu, Liang-Hong, Dai, Lin-Sun, Kang, De-Zhi, Zheng, Shu-Fa
Published in Frontiers in neurology (23.11.2022)
Published in Frontiers in neurology (23.11.2022)
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A Novel Titanium Cranioplasty Technique of Marking the Coronal and Squamosoparietal Sutures in Three-Dimensional Titanium Mesh as Anatomical Positioning Markers to Increase the Surgical Accuracy and Reduce Postoperative Complications
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Published in Frontiers in surgery (14.12.2021)
Published in Frontiers in surgery (14.12.2021)
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Treatment with a flow diverter-assisted coil embolization for ruptured blood blister-like aneurysms of the internal carotid artery: a technical note and analysis of single-center experience with pooled data
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Published in Neurosurgical review (20.11.2023)
Published in Neurosurgical review (20.11.2023)
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Journal Article
Correction to: Treatment with a flow diverter‑assisted coil embolization for ruptured blood blister‑like aneurysms of the internal carotid artery: a technical note and analysis of single‑center experience with pooled data
Zhang, Yi‑Bin, Yao, Pei‑Sen, Wang, Hao‑Jie, Xie, Bing‑Sen, Wang, Jia‑Yin, Zhu, Mei, Wang, Deng‑Liang, Yu, Liang‑Hong, Lin, Yuan‑Xiang, Gao, Bin, Zheng, Shu‑Fa, Kang, De‑Zhi
Published in Neurosurgical review (22.12.2023)
Published in Neurosurgical review (22.12.2023)
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Journal Article
METHOD FOR MAKING INTEGRATED PASSIVE DEVICE PACKAGE STRUCTURE
HUANG, BEN-XIA, FENG, LEI, XIE, BING-SEN, HONG, YE-JIE, CHEN, XIAN-MING
Year of Publication 01.04.2023
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Year of Publication 01.04.2023
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Embedded structure, preparation method and substrate
HUANG, BEN-XIA, FENG, LEI, XIE, BING-SEN, CHEN, XIAN-MING, WANG, WEN-SHI
Year of Publication 01.04.2022
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Year of Publication 01.04.2022
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TWI819320B
HUANG, BEN-XIA, FENG, LEI, ZHANG, JI-DA, PENG, JIAN, GAO, JUN, XIE, BING-SEN, CHEN, XIAN-MING
Year of Publication 21.10.2023
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Year of Publication 21.10.2023
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Integrated passive device package structure, method of making the same, and substrate having the same
HUANG, BEN-XIA, FENG, LEI, XIE, BING-SEN, HONG, YE-JIE, CHEN, XIAN-MING
Year of Publication 01.01.2022
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Year of Publication 01.01.2022
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TWI772132B
HUANG, BEN-XIA, FENG, LEI, FENG, JIN-DONG, XIE, BING-SEN, JIANG, LI-NA, CHEN, XIAN-MING
Year of Publication 21.07.2022
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Year of Publication 21.07.2022
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Embedded package structure and manufacturing method thereof
HUANG, BEN-XIA, FENG, LEI, FENG, JIN-DONG, XIE, BING-SEN, JIANG, LI-NA, CHEN, XIAN-MING
Year of Publication 16.02.2022
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Year of Publication 16.02.2022
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Temporary bearing plate and method of manufacturing coreless substrate using same
HUANG, BEN-XIA, FENG, LEI, ZHANG, JI-DA, PENG, JIAN, GAO, JUN, XIE, BING-SEN, CHEN, XIAN-MING
Year of Publication 01.01.2022
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Year of Publication 01.01.2022
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