Thermodynamic Coupling Forming Performance of Short Fiber-Reinforced PEEK by Additive Manufacturing
Sun, Qili, Wen, Xiaomu, Yin, Guangzhong, Jia, Zijian, Yang, Xiaomei
Published in Polymers (25.06.2024)
Published in Polymers (25.06.2024)
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Journal Article
Research Progress of Self-Healing Polymer for Ultraviolet-Curing Three-Dimensional Printing
Liu, Wenhao, Sun, Zhe, Ren, Hao, Wen, Xiaomu, Wang, Wei, Zhang, Tianfu, Xiao, Lei, Zhang, Guangpu
Published in Polymers (08.12.2023)
Published in Polymers (08.12.2023)
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Journal Article
GAP/CL-20-Based Compound Explosive: A New Booster Formulation Used in a Small-Sized Initiation Network
Yanju, Wei, Jingyu, Wang, Chongwei, An, Hequn, Li, Xiaomu, Wen, Binshuo, Yu
Published in Journal of energetic materials (02.01.2017)
Published in Journal of energetic materials (02.01.2017)
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Journal Article
In situ preparation of aluminum-copper pentafluorobenzoate energy microspheres: Enhancing aluminum combustion properties in composite propellants
Xiao, Fei, Chen, Chong, Zhang, Yongli, Wen, Xiaomu, Zhang, Jiangbo, Liu, Wei, Yang, Yongxia
Published in Combustion and flame (01.09.2024)
Published in Combustion and flame (01.09.2024)
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Journal Article
Improvement of mechanical properties of in situ -prepared HTPE binder in propellants
Chen, Keke, Wen, Xiaomu, Li, Guoping, Pang, Siping, Luo, Yunjun
Published in RSC advances (17.08.2020)
Published in RSC advances (17.08.2020)
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Journal Article
Applying modified hyperbranched polyester in hydroxyl‐terminated polyether/ammonium perchlorate/aluminium/cyclotrimethylenetrinitramine (HTPE/AP/Al/RDX) composite solid propellant
Wen, Xiaomu, Chen, Keke, Sang, Chao, Yuan, Shen, Luo, Yunjun
Published in Polymer international (01.01.2021)
Published in Polymer international (01.01.2021)
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Journal Article
Improvement of mechanical properties of -prepared HTPE binder in propellants
Chen, Keke, Wen, Xiaomu, Li, Guoping, Pang, Siping, Luo, Yunjun
Published in RSC advances (17.08.2020)
Published in RSC advances (17.08.2020)
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Journal Article
VOICE COMMUNICATION PROCESSING METHOD AND SYSTEM, ELECTRONIC DEVICE, AND STORAGE MEDIUM
WEN, Xiaomu, CHEN, Xiaobo, LUO, Cheng, LI, Bin, XI, Chi, WANG, Junshan
Year of Publication 22.02.2023
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Year of Publication 22.02.2023
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