2.5D Silicon optical interposer for 400 Gbps electronic-photonic integrated circuit platform packaging
Kim, Do-Won, Au, K.Y., Xianshu Luo, Hong Yu Li, Ye, Yong Liang, Bhattacharya, Surya, Lo, Guo Qiang
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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