An advanced rack server system design For Rotational Vibration (RV) performance
Xianguang Tan, Guofeng Chen, Jiajun Zhang, Chao Liu, Nishi Ahuja, Jun Zhang
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
Investigation on Advanced Cold Plate Liquid Cooling Solution for Large Scale Application in Data Center
Tan, Xianguang, Liu, Hongmei, Zhang, Jiajun, Tian, Wenbin, Yu, Jiang, Ruan, Xingping, Wang, Baolin, Wu, Lihui, Zhang, Jun, Ahuja, Nishi
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
A Novel Cost-Efficient High-Performance Aluminum Cold Plate Solution for Liquid Cooling System
Tan, Xianguang, Su, Li, Liu, Hongmei, Zhang, Jiajun, Zhang, Jun, Feng, Lijuan, Tian, Wenbin, Liang, Allen, Cheng, Hang, Ahuja, Nishi, Qiao, Qing
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
An Advanced Power and Thermal Optimized High Density Rack Solution for Data Center Energy Efficiency
Zhao, Jie, Tan, Xianguang, Pan, Yajun, Sheng, Yong, Liu, Hongmei, Zhang, Jiajun, Liu, Jing, Zhang, Jun, Chen, Carrie, Ahuja, Nish
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Advanced Thermal Solution for High Performance Server System Energy Efficiency
Tan, Xianguang, Zhao, Jie, Liu, Hongmei, Zhang, Jiajun, Zhang, Jun, Xu, Jialiang, Ahuja, Sandeep, Zhu, Dayi, Zhang, Ken
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
Advanced Single-phase Passive Immersion Cooling Solution with Natural Convection for Outdoor Edge Servers
Guo, Liwen, Wu, Jiahong, Hsieh, I-Min, Huang, Cheng-Hua, Li, Bo, Jao, Chiming, Lin, Vinson, Yuan, Robert, Tan, Xianguang, Fan, Xiaojin, Wu, Zhenghui, Sheng, Yong, He, Yongzhan, Zhang, Jiajun, Zhang, Jun, Chen, Carrie, Xia, Yuyang, Lv, Wenqing, Wu, Min, Du, Chris, He, Candy, Zhang, Jonas, Ahuja, Nishi, Qiao, Qing
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Machine cabinet for dissipating heat
Zhang, Binghua, Ding, Ruiquan, Zhou, Tianyu, Tan, Xianguang, Tang, Hu
Year of Publication 27.11.2018
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Year of Publication 27.11.2018
Patent
Liquid cooling for electronic racks with liquid cooled IT components in data centers
Gao, Tianyi, Cui, Yan, Luo, Zhiming, Zhou, Tianyu, Tan, Xianguang, Tang, Hu
Year of Publication 05.03.2019
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Year of Publication 05.03.2019
Patent
A DESIGN OF LIQUID COOLING FOR ELECTRONIC RACKS WITH LIQUID COOLED IT COMPONENTS IN DATA CENTERS
ZHOU, Tianyu, TAN, Xianguang, LUO, Zhiming, CUI, Yan, GAO, Tianyi, TANG, Hu
Year of Publication 31.01.2019
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Year of Publication 31.01.2019
Patent
A DESIGN OF LIQUID COOLING FOR ELECTRONIC RACKS WITH LIQUID COOLED IT COMPONENTS IN DATA CENTERS
Gao, Tianyi, Cui, Yan, Luo, Zhiming, Zhou, Tianyu, Tan, Xianguang, Tang, Hu
Year of Publication 31.01.2019
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Year of Publication 31.01.2019
Patent