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Year of Publication 15.08.2023
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Camera module and molding circuit board assembly, circuit board and application thereof
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Year of Publication 15.06.2021
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Year of Publication 15.06.2021
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Photosensitive assembly and camera module and manufacturing method thereof
Xi, Fengsheng, Deng, Zilong, Chen, Zhenyu, Luan, Zhongyu, Zhao, Bojie, Huang, Zhen, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu
Year of Publication 11.01.2022
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Year of Publication 11.01.2022
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Photosensitive component, and camera module and manufacturing method therefor
Xi, Fengsheng, Deng, Zilong, Chen, Zhenyu, Luan, Zhongyu, Zhao, Bojie, Huang, Zhen, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu, Wu, Ye
Year of Publication 12.07.2022
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Year of Publication 12.07.2022
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Molded photosensitive assembly of array imaging module
Xi, Fengsheng, Chen, Zhenyu, Luan, Zhongyu, Ding, Liang, Zhao, Bojie, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu, Chen, Feifan
Year of Publication 02.02.2021
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Year of Publication 02.02.2021
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Molded photosensitive assembly for array imaging module for electronic device
Xi, Fengsheng, Chen, Zhenyu, Luan, Zhongyu, Ding, Liang, Zhao, Bojie, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu, Chen, Feifan
Year of Publication 03.03.2020
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Year of Publication 03.03.2020
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Photosensitive assembly and camera module and manufacturing method thereof
Xi, Fengsheng, Deng, Zilong, Chen, Zhenyu, Luan, Zhongyu, Zhao, Bojie, Huang, Zhen, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu
Year of Publication 03.03.2020
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Year of Publication 03.03.2020
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Photosensitive assembly and camera module and manufacturing method thereof
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Year of Publication 11.06.2019
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Year of Publication 11.06.2019
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Manufacturing method of a molded photosensitive assembly of an array imaging module
Xi, Fengsheng, Chen, Zhenyu, Luan, Zhongyu, Ding, Liang, Zhao, Bojie, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu, Chen, Feifan
Year of Publication 30.04.2019
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Year of Publication 30.04.2019
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Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Xi, Fengsheng, Chen, Zhenyu, Luan, Zhongyu, Ding, Liang, Zhao, Bojie, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu, Chen, Feifan
Year of Publication 08.01.2019
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Year of Publication 08.01.2019
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Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Xi, Fengsheng, Chen, Zhenyu, Luan, Zhongyu, Ding, Liang, Zhao, Bojie, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu, Chen, Feifan
Year of Publication 04.12.2018
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Year of Publication 04.12.2018
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Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Xi, Fengsheng, Chen, Zhenyu, Luan, Zhongyu, Ding, Liang, Zhao, Bojie, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu, Chen, Feifan
Year of Publication 13.11.2018
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Year of Publication 13.11.2018
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Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
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Year of Publication 04.10.2018
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Year of Publication 04.10.2018
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Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Xi, Fengsheng, Chen, Zhenyu, Luan, Zhongyu, Ding, Liang, Zhao, Bojie, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Wang, Mingzhu, Chen, Feifan
Year of Publication 24.07.2018
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Year of Publication 24.07.2018
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Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
Xi, Fengsheng, WANG, Mingzhu, Chen, Zhenyu, Luan, Zhongyu, Ding, Liang, Zhao, Bojie, Jiang, Heng, Tanaka, Takehiko, Guo, Nan, Chen, Feifan
Year of Publication 14.06.2018
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Year of Publication 14.06.2018
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