Influence mechanism of dispersion and agglomeration characteristics of micron/nano carbon dust on its combustion kinetics and explosion process
Mu, Jie, Bao, Qifu, Wang, Shenghua, Zhu, Jianmiao, Li, Xuesheng, Jia, Bo, Chen, Xuefan, Liu, Taosong
Published in Fullerenes, nanotubes, and carbon nanostructures (01.02.2024)
Published in Fullerenes, nanotubes, and carbon nanostructures (01.02.2024)
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Journal Article
Efficient Online Index Maintenance for SSD-based Information Retrieval Systems
Ruixuan Li, Xuefan Chen, Chengzhou Li, Xiwu Gu, Kunmei Wen
Published in 2012 IEEE 14th International Conference on High Performance Computing and Communication & 2012 IEEE 9th International Conference on Embedded Software and Systems (01.06.2012)
Published in 2012 IEEE 14th International Conference on High Performance Computing and Communication & 2012 IEEE 9th International Conference on Embedded Software and Systems (01.06.2012)
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Conference Proceeding
A New Algorithm for EM Analysis Considering Multiple Driving Forces Mechanism
Lihua Liang, Yuanxiang zhang, Xuefan Chen, Yong Liu
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Electromigration simulation with consideration of the atomic concentration gradient
Xuefan Chen, Lihua Liang, Yong Liu
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
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Conference Proceeding
A new prediction methodology for electromigration-induced solder degradation in a WL-CSP system
Yong Liu, Qiang Wang, Lihua Liang, Xuefan Chen, Irving, S., Luk, T.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Impact of the UBM geometry and solder bump shape on electromigration reliability in a package system
Yuanxiang Zhang, Lihua Liang, Xuefan Chen, Yong Liu, Timwah Luk, Irving, S.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Characterization of dynamic behavior of Pb-free material 95.7Sn3.8Ag0.5Cu and its determination of dynamic constitutive model parameters
Liang Lihua, Chen Xuefan, Wang Qiang, Liu Fei, Yong Liu, Irving, S., Timwah Luk
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding